Micromachine and method for manufacturing the same

ABSTRACT

A semiconductor element of the electric circuit includes a semiconductor layer over a gate electrode. The semiconductor layer of the semiconductor element is formed of a layer including polycrystalline silicon which is obtained by crystallizing amorphous silicon by heat treatment or laser irradiation, over a substrate. The obtained layer including polycrystalline silicon is also used for a structure layer such as a movable electrode of a structure body. Therefore, the structure body and the electric circuit for controlling the structure body can be formed over one substrate. As a result, a micromachine can be miniaturized. Further, assembly and packaging are unnecessary, so that manufacturing cost can be reduced.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/922,302, filed Jun. 20, 2013, now allowed, which is a continuation ofU.S. application Ser. No. 13/214,293, filed Aug. 22, 2011, now U.S. Pat.No. 8,470,695, which is a divisional of U.S. application Ser. No.11/684,711, filed Mar. 12, 2007, now U.S. Pat. No. 8,008,735, whichclaims the benefit of a foreign priority application filed in Japan asSerial No. 2006-076728 on Mar. 20, 2006, all of which are incorporatedby reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a micromachine which includes astructure body and an electric circuit having a semiconductor elementover one substrate, and a method for manufacturing the micromachine.

2. Description of the Related Art

A micromachine is also called MEMS (Micro Electro Mechanical Systems)and MST (Micro System Technology) and refers to a comprehensive systemcombining a micromechanical structure body and an electric circuit. Theabove structure body is different from a general semiconductor elementin having a three-dimensional structure, a part of which is movable inmany cases. The structure body can have various functions like a passiveelement such as a sensor, an actuator, an inductor, or a variablecapacitor, a switch, or the like. The electric circuit is generallyformed using a semiconductor element and can control the operation ofthe structure body, or receive and process a weak signal outputted fromthe structure body.

Further, micromachines can be classified into two groups according totheir manufacturing methods. One is bulk micromachines in whichstructure bodies are manufactured using crystal anisotropy of a siliconsubstrate, and the other is surface micromachines in whichthree-dimensional structure bodies are manufactured over varioussubstrates by stacking thin films (see Reference 1: Japanese PatentPublication No. 3590283). In particular, surface micromachines have beenactively researched, especially in the United States, because astructure body and an electric circuit can be formed over one substrate.

SUMMARY OF THE INVENTION

A structure body included in a micromachine has a three-dimensionalstructure including a portion fixed to a substrate, a movable portionpartially fixed to a substrate, and a spatial portion providedtherebetween. A step of temporarily forming a layer for forming theshape of the spatial portion (referred to as a sacrifice layer), and astep of lastly removing the sacrifice layer which is referred to assacrifice layer etching are required in order to provide the structurebody with a spatial portion. Since these steps are different from thosein manufacturing a general semiconductor element, a semiconductorelement included in an electric circuit, and a structure are oftenmanufactured over different substrates through different steps. Amicromachine is often manufactured by manufacturing them separately andthen integrating them with each other by attaching the substrates toeach other or putting and connecting them in one package.

However, according to a method by which a semiconductor element and astructure body are manufactured separately as described above, it isvery difficult to downsize a micromachine and reduce manufacturing cost.It is currently desired to form a structure body and an electric circuitover one substrate for downsizing and cost reduction. Therefore, it isan object of the present invention to provide a micromachine in which astructure body and an electric circuit are formed over one substrate. Itis another object of the present invention to provide a method formanufacturing the micromachine.

In order to achieve the above objects, one feature of the micromachineof the present invention is to include a structure body which is formedusing a layer including polycrystalline silicon. The polycrystallinesilicon is formed by, for example, thermal crystallization or lasercrystallization. The polycrystalline silicon can also be formed bythermal crystallization or laser crystallization using metal.Polycrystalline silicon as described above can be formed over asubstrate having an insulating surface, for example, a glass substrateand has high strength in thin film form; therefore, it can be used forthe structure body. Further, the use of the polycrystalline silicon fora semiconductor layer of a semiconductor element can improve theelectrical property of the semiconductor element. A micromachineincluding a structure body and an electric circuit over one substratecan be manufactured by forming a structure body and a semiconductorelement using polycrystalline silicon as described above.

A micromachine and a structure body included in a micromachine aredescribed. The micromachine of the present invention includes astructure body having a three-dimensional structure with aselectively-formed spatial portion and an electric circuit forcontrolling the structure body and detecting the output from thestructure body. The structure body includes two electrodes which faceeach other with the spatial portion interposed therebetween. One of themis a fixed electrode which is fixed to a substrate and is not movable(also referred to as a first conductive layer in this specification),and the other is a movable electrode which is partially fixed to asubstrate and is movable (also referred to as a second conductive layerin this specification). The second conductive layer which is movable maybe formed using a single layer, but a movable portion may also be formedby stacking an insulating layer, a semiconductor layer, and the likeabove and below the second conductive layer. In this specification, amovable layer formed using a single layer or a stacked layer of thesecond conductive layer or an insulating layer is referred to as astructure layer. The spatial portion included in the structure body isformed by initially forming a sacrifice layer to form the shape of thespatial portion and lastly removing the sacrifice layer. The removal ofthe sacrifice layer is performed by etching, and this step is referredto as sacrifice layer etching in this specification.

In the structure body, the structure layer can move in the spatialportion in many cases. The movement of the structure layer here includesup-and-down movement (along a direction perpendicular to a substrate),lateral movement (along a direction parallel to a substrate), androtation on a certain axis with one or more points of the structurelayer connected to and supported by the substrate.

One feature of the micromachine of the present invention is to includean electric circuit and a structure body electrically connected to theelectric circuit, which are provided over an insulating surface. Thestructure body includes a semiconductor layer and a spatial portion. Thespatial portion of the structure body is provided between the insulatingsurface and the semiconductor layer. The semiconductor layer of thestructure body is a layer including polycrystalline silicon.

The layer including polycrystalline silicon can have a stacked structureof polycrystalline silicon and amorphous silicon. The layer includingpolycrystalline silicon can have a stacked structure of two or morelayers of polycrystalline silicon, amorphous silicon, and a compound ofsilicon and metal. The layer including polycrystalline silicon can havea stacked structure of layers including polycrystalline silicon withdifferent crystal growth directions. The layer including polycrystallinesilicon can partially have a region with a different crystal structure.

The electric circuit of the micromachine of the present inventionincludes a semiconductor element. The semiconductor element includes asemiconductor layer over a gate electrode and can further includeanother gate electrode over the semiconductor layer.

The micromachine of the present invention can include an oppositesubstrate which faces the insulating surface. The opposite substrate isprovided with a protective layer or a conductive layer. The protectivelayer is provided in a region where the structure body is not provided.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer is formed overa substrate, and a first sacrifice layer is formed over the firstconductive layer. A conductive film is formed and processed into apredetermined shape, thereby forming a gate electrode, and a secondsacrifice layer over the first sacrifice layer. A first insulating layeris formed over the gate electrode. A film including silicon is formedand processed into a predetermined shape, thereby forming asemiconductor layer over the gate electrode with the first insulatinglayer interposed therebetween, and a structure layer over the secondsacrifice layer, respectively. A part of the first sacrifice layer andthe second sacrifice layer are removed.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer is formed overa substrate, and a first sacrifice layer is formed over the firstconductive layer. A conductive film is formed and processed into apredetermined shape, thereby forming a gate electrode, and a secondsacrifice layer over the first sacrifice layer. A first insulating layeris formed over the gate electrode. A film including silicon is formedand processed into a predetermined shape, thereby forming asemiconductor layer over the gate electrode with the first insulatinglayer interposed therebetween, and a structure layer over the secondsacrifice layer, respectively. A second insulating layer is formed overthe semiconductor layer and the structure layer, and a second conductivelayer is formed over the second insulating layer. Apart of the secondinsulating layer is removed to expose a part of the first sacrificelayer and the second sacrifice layer, and a part of the first sacrificelayer, and the second sacrifice layer are removed.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer is formed overa substrate, and a first sacrifice layer is formed over the firstconductive layer. A conductive film is formed and processed into apredetermined shape, thereby forming a gate electrode, and a secondsacrifice layer over the first sacrifice layer. A first insulating layeris formed over the gate electrode. A film including silicon is formedand processed into a predetermined shape, thereby forming asemiconductor layer over the gate electrode with the first insulatinglayer interposed therebetween, and a structure layer over the secondsacrifice layer, respectively. A conductive film is formed and processedinto a predetermined shape, thereby forming a second conductive layerover each of the semiconductor layer and the structure layer. A part ofthe first sacrifice layer and the second sacrifice layer are removed. Inthe above manufacturing method, a feature of the semiconductor layer isto be a stacked layer of an amorphous semiconductor or a semiconductorincluding microcrystal and a semiconductor to which an impurity isadded.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer and a firstsacrifice layer are stacked over a substrate, and a conductive film isformed and processed into a predetermined shape, thereby forming a gateelectrode, and a second sacrifice layer over the first sacrifice layer.A first insulating layer is formed over the gate electrode. A filmincluding silicon is formed and processed into a predetermined shape,thereby forming a semiconductor layer over the gate electrode with thefirst insulating layer interposed therebetween, and a structure layerover the second sacrifice layer, respectively. A conductive film isformed and processed into a predetermined shape, thereby forming asecond conductive layer over each of the semiconductor layer and thestructure layer, and a second insulating layer is formed over the secondconductive layer. A third conductive layer is formed over the secondinsulating layer, and a part of the second insulating layer is removedto expose a part of the first sacrifice layer and the second sacrificelayer, and a part of the first sacrifice layer, and the second sacrificelayer are removed. The semiconductor layer may be a stacked layer of anamorphous semiconductor or a semiconductor including microcrystal and asemiconductor to which an impurity is added.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer and a firstgate electrode are formed over a substrate. A first insulating layer isformed over the first gate electrode, and a semiconductor layer isformed over each of the first conductive layer, and the first gateelectrode with the first insulating layer interposed therebetween. Asecond insulating layer is formed over the semiconductor layer over thefirst gate electrode, and a conductive film is formed and processed intoa predetermined shape, thereby forming a second conductive layer overthe semiconductor layer over the first conductive layer and a secondgate electrode over the semiconductor layer over the first gateelectrode, respectively. Apart of the first conductive layer, or a partor all of the second conductive layer is removed.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer and a firstgate electrode are formed over a substrate. A first insulating layer isformed over the first gate electrode, and a semiconductor layer isformed over each of the first conductive layer, and the first gateelectrode with the first insulating layer interposed therebetween. Asecond insulating layer is formed over the semiconductor layer over thefirst gate electrode. A conductive film is formed and processed into apredetermined shape, thereby forming a second conductive layer over thesemiconductor layer over the first conductive layer and a second gateelectrode over the semiconductor layer over the first gate electrode,respectively, and the semiconductor layer over the first conductivelayer is removed.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer and a firstgate electrode are formed over a substrate, and a first insulating layeris formed over the first gate electrode. A semiconductor layer is formedover each of the first conductive layer, and the first gate electrodewith the first insulating layer interposed therebetween. A secondinsulating layer is formed over the semiconductor layer over the firstgate electrode. A conductive film is formed and processed into apredetermined shape, thereby forming a second conductive layer over thesemiconductor layer over the first conductive layer and a second gateelectrode over the semiconductor layer over the first gate electrode,respectively. A third insulating layer is formed over the secondconductive layer and the second gate electrode, and a third conductivelayer is formed over the third insulating layer. A part of the thirdinsulating layer is removed to expose a part of the first conductivelayer or the second conductive layer, and a part of the first conductivelayer, or a part or all of the second conductive layer is removed.

One feature of one of methods for manufacturing the micromachine of thepresent invention is as follows. A first conductive layer and a firstgate electrode are formed over a substrate, and a first insulating layeris formed over the first gate electrode. A semiconductor layer is formedover the first conductive layer, and the first gate electrode with thefirst insulating layer interposed therebetween. A second insulatinglayer is formed over the semiconductor layer over the first gateelectrode. A conductive film is formed and processed into apredetermined shape, thereby forming a second conductive layer over thesemiconductor layer over the first conductive layer and a second gateelectrode over the semiconductor layer over the first gate electrode,respectively. A third insulating layer is formed over the secondconductive layer and the second gate electrode, and a third conductivelayer is formed over the third insulating layer. A part of the thirdinsulating layer is removed to expose a part of the semiconductor layerover the first conductive layer, and the semiconductor layer over thefirst conductive layer is removed.

The present invention can provide a small-size micromachine because astructure body and an electric circuit including a semiconductor elementare formed over one substrate. The manufacturing method of the presentinvention can downsize a micromachine as a whole because a structurebody and an electric circuit including a semiconductor element can besimultaneously formed over one substrate. In addition, formation overone substrate can eliminate assembling and packaging steps, and canreduce manufacturing cost.

The present invention makes it possible to form a strong structure bodyand a semiconductor element with excellent element properties over onesubstrate by using polycrystalline silicon, which is crystallized overthe substrate, for a structure layer of the structure body and asemiconductor layer of the semiconductor element. The polycrystallinesilicon can be formed at a low temperature over a substrate having a lowmelting point such as a glass substrate by crystallizing silicon using ametal element such as nickel (Ni). In addition, the hardness, the springconstant, and the like of a structure layer can be adjusted and astructure layer having desired properties can be manufactured bystacking silicon having various properties such as amorphous silicon orpolycrystalline silicon and a compound of silicon and metal.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 2A and 2B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 3A and 3B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 4A and 4B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 5A and 5B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 6A and 6B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 7A and 7B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 8A and 8B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 9A to 9D are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIG. 10 is a diagram illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 11A to 11C are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 12A and 12B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 13A and 13B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 14A and 14B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 15A and 15B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 16A and 16B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 17A and 17B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 18A and 18B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 19A and 19B are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 20A to 20C are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 21A to 21E are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIGS. 22A to 22D are diagrams illustrating a method for manufacturing amicromachine of the present invention.

FIG. 23 is a diagram illustrating a micromachine of the presentinvention.

FIGS. 24A to 24C are diagrams each illustrating a micromachine of thepresent invention.

FIGS. 25A and 25B are diagrams each illustrating a structure bodyincluded in a micromachine of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiment modes of the present invention are hereinafter explained withreference to the drawings. However, the present invention is not limitedto the following description. This is because a person skilled in theart will easily understand that the mode and detail of the presentinvention can be variously modified without departing from the spiritand scope of the present invention. Therefore, the present invention isnot interpreted as being limited to the following description of theembodiment modes. Note that the same reference numeral may be commonlyused to denote the same portion among different diagrams in explainingthe structure of the present invention with reference to drawings.

(Embodiment Mode 1)

This embodiment mode explains a method for manufacturing a structurebody and an electric circuit electrically connected to the structurebody, which are included in a micromachine, over one substrate withreference to FIGS. 1A to 5B. Some of the drawings each include a topview on an upper side and a cross-sectional view of the top view takenalong a line O-P on a lower side. In this embodiment mode, a process ofmanufacturing a semiconductor element which constitutes a part of anelectric circuit is typically described for convenience as a process ofmanufacturing the electric circuit. This applies to other embodimentmodes.

<Substrate 101>

The structure body and the semiconductor element the micromachine of thepresent invention includes can be manufactured over an insulatingsubstrate. The insulating substrate here can be, for example, a glasssubstrate, a quartz substrate, a plastic substrate, or the like.Further, a conductive substrate such as a metal substrate or asemiconductor substrate of silicon, germanium, a compound of silicon andgermanium, or the like can also be used. In this case, the substrate canbe used without any change, or may be used after an insulating layer isformed on its surface.

A highly-flexible and thin micromachine can be manufactured by formingthe structure body and the semiconductor element over a thin and softsubstrate like, for example, a plastic substrate. When the structurebody and the semiconductor element are formed using a glass substrate, athin micromachine can also be formed by polishing and thinning thesubstrate from the backside.

<Base Layer 102>

In this embodiment mode, a layer 102 serving as a base is formed over asubstrate 101 having an insulating surface (see a lower diagram of FIG.1A). The base layer 102 can be formed using an insulating layer such asa silicon oxide layer, a silicon nitride layer, or a silicon oxynitridelayer. The base layer 102 may be formed using a single layer of theabove-mentioned material or by stacking a plurality of the materials.This embodiment mode describes an example of stacking two layers as thebase layer 102.

As a first layer of the base layer 102, a silicon oxynitride layer canbe formed by a plasma CVD method using SiH₄, NH₃, N₂O, and H₂ asreactive gases with a thickness of 10 nm to 200 nm (preferably 50 nm to100 nm). In this embodiment mode, a silicon oxynitride layer with athickness of 50 nm is formed. Next, as a second layer of the base layer102, a silicon oxynitride layer can be formed thereover by a plasma CVDmethod using SiH₄ and N₂O as reactive gases with a thickness of 50 nm to200 nm (preferably 100 nm to 150 nm). In this embodiment mode, a siliconoxynitride layer with a thickness of 100 nm is formed.

<First Conductive Layer 103>

Next, a conductive layer is formed over the base layer 102 and processedinto a predetermined shape, thereby forming a first conductive layer 103for driving the structure body. As the conductive layer for forming thefirst conductive layer 103, a film of an element or a compound of metal,silicon, or the like such as tantalum or tantalum nitride is formed by asputtering method, a CVD method, or the like. Then, a resist mask isformed by a photolithography method, and the film is processed byetching. The etching performed here is desirably anisotropic dry etchingcapable of processing a layer perpendicularly to the substrate.

<First Sacrifice Layer 104>

Next, a layer for forming a first sacrifice layer 104 is formed over thefirst conductive layer 103 and processed into a predetermined shape,thereby forming the first sacrifice layer 104. As the layer for formingthe first sacrifice layer 104, a film of an element or a compound ofmetal, silicon, or the like such as tungsten or silicon nitride isformed by a sputtering method, a CVD method, or the like. Then,similarly to the first conductive layer 103, a resist mask is formed bya photolithography method, and the layer is processed by etching.

Here, the first conductive layer 103 and the first sacrifice layer 104can be processed at the same time. In this case, the layers for formingthe first conductive layer 103 and the first sacrifice layer 104 arecontinuously formed, a resist mask is formed by a photolithographymethod, and the layers are processed at the same time by etching in aself-aligned manner. By processing two layers at the same time asdescribed above, the number of reticles (also referred to as photomasks)to be used can be reduced, and the cost for manufacturing a micromachinecan be reduced. This embodiment mode describes an example of processingthe first conductive layer 103 and the first sacrifice layer 104 at thesame time (see FIG. 1A).

Here, the thickness of the first sacrifice layer 104 is determined byconsidering various factors such as a material of the first sacrificelayer 104, a structure and an operating method of the structure body,and a method of sacrifice layer etching. For example, when the firstsacrifice layer 104 is too thin, there is a problem in that an etchantis not dispersed and the sacrifice layer below a structure layer is notetched. Further, when the sacrifice layer is thin, a phenomenon occursin which a lower surface of the structure layer attaches to a substratesurface after etching the sacrifice layer (this phenomenon is alsoreferred to as buckling or sticking). On the other hand, when thesacrifice layer is too thick, there is a problem in that an extremelyhigh drive voltage is required to operate the structure body byelectrostatic attraction or the structure body does not operate in somecases.

In view of the above factors, the first sacrifice layer 104 has athickness of 0.5 μm to 4 μm, preferably 1 μm to 2.5 μm in a case wherethe structure body is operated by, for example, electrostatic attractionbetween the conductive layer and the structure layer formed over thesubstrate.

A material used for forming the first sacrifice layer 104 preferablysatisfies the condition where there is an etchant that has properties ofetching the first sacrifice layer 104 but hardly etching the firstconductive layer 103 and other layers which are not to be removed.

<Gate Electrode 105 and Second Sacrifice Layer 106>

Next, a gate electrode 105 which constitutes a part of a semiconductorelement is formed over the base layer 102, and a second sacrifice layer106 for forming the structure body is formed over the first sacrificelayer 104. The gate electrode 105 and the second sacrifice layer 106 areformed using a layer of conductive metal or compound such as molybdenumor tungsten by a sputtering method, a CVD method, or the like. Then, theformed conductive layer is processed by a photolithography method andetching, similarly to the first sacrifice layer 104 (see FIG. 1B).

For example, even when the first sacrifice layer 104 has strong internalstress and has poor adhesion to (is easily peeled from) the base layer102 and the first conductive layer 103, the sacrifice layer can beformed to be thick by repeatedly forming a film of a sacrifice layermaterial and etching the film. This embodiment mode describes an exampleof separately forming two sacrifice layers (the first sacrifice layer104 and the second sacrifice layer 106) in order to form the sacrificelayer to be thick. Further, this embodiment mode describes an example offorming the second sacrifice layer 106 and the gate electrode 105 at thesame time.

A material for forming the second sacrifice layer 106 and the gateelectrode 105 is preferably the same as that of the first sacrificelayer 104 or a material that can be etched by the same method. Forexample, when the first sacrifice layer 104 and the second sacrificelayer 106 are formed of the same material, sacrifice layer etching canbe performed at a time; thus, the number of steps can be reduced.However, the sacrifice layers can be formed using different materialsdepending on a condition such as adhesion to a layer formed above orbelow the sacrifice layer. In this case, sacrifice layer etching forforming the structure body may be separately performed twice. Thisembodiment mode describes an example of forming the first sacrificelayer 104, and the second sacrifice layer 106 and the gate electrode 105using the same material.

The first conductive layer 103, and the first sacrifice layer 104, thegate electrode 105, and the second sacrifice layer 106 are processed byetching (particularly, anisotropic dry etching). An example of theanisotropic dry etching is an ICP (Inductively Coupled Plasma) etchingmethod. At this time, processability can be improved by appropriatelyadjusting etching conditions (such as the amount of power applied to acoil electrode, the amount of power applied to an electrode on thesubstrate 101 side, and the temperature of the electrode on thesubstrate 101 side). Note that an etching gas appropriately used forprocessing the first sacrifice layer 104, the second sacrifice layer106, and the gate electrode 105 can be: a chlorine-based gas typified byCl₂, BCl₃, SiCl₄, CCl₄, or the like; a fluorine-based gas typified byCF₄, SF₆, NF₃, or the like; or O₂.

By adjustment of the above etching conditions, the first sacrifice layer104, the gate electrode 105, and the second sacrifice layer 106 can beprocessed into a predetermined shape such as a trapezoidal shape with ataper angle (see FIG. 2A). Here, the taper angle refers to an obtuseangle between the substrate and a layer side face (an angle indicated by“a” in FIG. 2A), and a cross section of a layer with a taper angle istrapezoidal. Alternatively, the layer for forming the first sacrificelayer 104 and the layer for forming the gate electrode 105 and thesecond sacrifice layer 106 can be formed using different materials inorder to improve processability by etching as described above. When thefirst sacrifice layer 104, the gate electrode 105, and the secondsacrifice layer 106 are each formed to have a shape with a taper angleas described above, a layer to be formed over a step can be uniformlyformed.

Although the first sacrifice layer 104, the gate electrode 105, and thesecond sacrifice layer 106 are processed into a shape with a taper anglein FIG. 2A, not all layers need to be formed to have a taper angle. Forexample, only the first sacrifice layer 104 may be processed into ashape with a taper angle. Alternatively, it is possible that the firstsacrifice layer 104 is not formed to have a taper angle and the gateelectrode 105 and the second sacrifice layer 106 are formed to have ataper angle.

As shown in FIG. 2B, the sacrifice layer can be formed with a singlelayer. In this case, the gate electrode 105 can be formed at the sametime as the first conductive layer 103 and the first sacrifice layer104. By forming the sacrifice layer with a single layer, a singlereticle (photomask) for the sacrifice layer becomes unnecessary, and thestep of film formation and processing can be reduced.

<First Insulating Layer 107>

Next, a first insulating layer 107 is formed over the gate electrode 105and the second sacrifice layer 106 as shown in FIG. 1B. The firstinsulating layer 107 functions as a gate insulating layer in thesemiconductor element. Similarly to the above-described base layer 102,the first insulating layer 107 can be formed using a material includingsilicon such as silicon oxide or silicon nitride by a plasma CVD method,a sputtering method, or the like. For example, the first insulatinglayer 107 can be formed using a silicon oxynitride layer (compositionratio: Si=32%, O=59%, N=7%, H=2%) by a plasma CVD method with athickness of 115 nm. However, the first insulating layer 107 is notlimited to a silicon oxynitride layer and may be formed using a singlelayer or a stacked layer of other insulating layers including silicon.

The first insulating layer 107 can alternatively be formed using metaloxide with high permittivity such as hafnium (Hf) oxide or titanium (Ti)oxide. When the first insulating layer 107 is formed using such ahigh-permittivity material, the semiconductor element can be driven withlow voltage and a micromachine which consumes low power can bemanufactured.

Alternatively, the first insulating layer 107 can be formed byhigh-density plasma treatment. The high-density plasma treatment isplasma treatment with a plasma density of 1×10¹¹ cm⁻³ or more,preferably 1×10¹¹ cm⁻³ to 9×10¹⁵ cm⁻³ using a high frequency such as amicrowave (for example, with a frequency of 2.45 GHz). When plasma isproduced under such conditions, the electron temperature is as low as0.2 eV to 2 eV. Thus, high-density plasma, a feature of which is lowelectron temperature, has low kinetic energy of active species;therefore, a layer can be formed with little plasma damage and fewdefects.

The substrate is placed in a film formation chamber capable of suchplasma treatment, and film formation treatment is carried out with adistance between an electrode for generating plasma, a so-calledantenna, and a target set in the range of 20 mm to 80 mm, preferably 20mm to 60 mm. Such high-density plasma treatment can realize a lowtemperature process (substrate temperature: 400° C. or less).Accordingly, a glass or plastic substrate having low heat resistance canbe used as the substrate 101.

The atmosphere for forming such an insulating layer may be a nitrogenatmosphere or an oxygen atmosphere. The nitrogen atmosphere is typicallya mixed atmosphere of nitrogen and a rare gas, or a mixed atmosphere ofnitrogen, hydrogen, and a rare gas. At least one of helium, neon, argon,krypton, and xenon can be used as the rare gas. The oxygen atmosphere istypically a mixed atmosphere of oxygen and a rare gas; a mixedatmosphere of oxygen, hydrogen, and a rare gas; or a mixed atmosphere ofdinitrogen monoxide and a rare gas. At least one of helium, neon, argon,krypton, and xenon can be used as the rare gas.

The insulating layer formed by high-density plasma treatment is denseand causes little damage to other films. Further, the state of aninterface between the insulating layer formed and a layer to be incontact therewith can be improved. For example, when the firstinsulating layer 107 is formed by oxidizing or nitriding a semiconductorlayer through high-density plasma treatment, the state of an interfacebetween the insulating layer and the semiconductor layer formed over theinsulating layer can be improved. Accordingly, electrical properties ofthe semiconductor element can be improved. Further, by formation of theinsulating layer over the structure layer as described above, damage toa layer for forming the structure body or the like can be reduced, andthe strength of the structure layer can be maintained. In addition,high-density plasma treatment can also be used when forming not only thefirst insulating layer 107 but also the base layer 102 and anotherinsulating layer.

<Semiconductor Layer 109 and Structure Layer 108>

Next, a semiconductor layer 109 which constitutes a part of thesemiconductor element and a semiconductor layer to be a structure layer108 which constitutes a part of the structure body are formed over thefirst insulating layer 107 and processed into a predetermined shape (seeFIG. 3A). The semiconductor layer 109 and the structure layer 108 can beformed of a material including silicon. An example of the materialincluding silicon is: silicon, silicon germanium including germanium of0.01 atomic % to 4.5 atomic %, or the like. In the present invention, anamorphous semiconductor layer is formed and crystallized by heattreatment, thereby forming a crystalline semiconductor layer. The heattreatment may be performed by heating using a heating furnace, laserlight irradiation, irradiation with light emitted from a lamp (alsoreferred to as lamp annealing), or a combination thereof.

The material and the thickness of the structure layer 108 are determinedby considering various factors such as thicknesses of the firstsacrifice layer 104 and the second sacrifice layer 106, a material ofthe structure layer 108, a structure of the structure body, and a methodof sacrifice layer etching. For example, the structure layer 108 warpswhen the structure layer 108 is formed using a material with a largedistribution difference of internal stress. However, the structure bodymay be formed using this warpage of the structure layer 108. Since thestructure layer 108 and the semiconductor layer 109 are formed at thesame time in this embodiment mode, the structure layer 108 is formedusing a crystalline semiconductor layer.

When the structure layer 108 is formed to be thick, the distribution ofinternal stress is generated, which may cause warpage or buckling. Incontrast, when the structure layer 108 is thin, the structure body maybe buckled due to the surface tension of a solution used for sacrificelayer etching. For example, in a case of forming the structure layer 108using a semiconductor layer as in this embodiment mode, the thickness ofthe structure layer 108 is preferably 0.5 μm to 10 μm.

In a case of using laser irradiation in heat treatment for forming acrystalline semiconductor layer by crystallization of an amorphoussemiconductor layer, a continuous wave laser beam (CW laser beam) or apulsed laser beam can be used. As a laser beam, a laser beam emittedfrom one or more of the following lasers can be used: an Ar laser, a Krlaser, an excimer laser, a YAG laser, a Y₂O₃ laser, a YVO₄ laser, a YLFlaser, a YAlO₃ laser, a glass laser, a ruby laser, an alexandrite laser,a Ti:sapphire laser, a copper vapor laser, and a gold vapor laser. Whena fundamental wave of such a laser or one of the second to fourthharmonics of the laser is used, crystals with a large grain size can beobtained. For example, the second harmonic (532 nm) or the thirdharmonic (355 nm) of an Nd:YVO₄ laser (fundamental wave: 1064 nm) can beused for irradiation. In this case, the laser beam requires a powerdensity of approximately 0.01 MW/cm² to 100 MW/cm² (preferably 0.1MW/cm² to 10 MW/cm²). Then, irradiation is performed at a scan speed ofapproximately 10 cm/sec to 2000 cm/sec.

Note that a fundamental wave of a CW laser and a harmonic of a CW lasermay be used for irradiation, or a fundamental wave of a CW laser and aharmonic of a pulsed laser may be used for irradiation. With the use ofa plurality of laser beams, the energy can be compensated.

It is also possible to use a pulsed laser which emits a beam at arepetition rate that allows the laser beam of a next pulse to be appliedafter the semiconductor layer is melted by a previous laser beam andbefore it is solidified. By irradiation with a laser beam emitted atsuch a repetition rate, crystal grains which have grown continuouslyalong the scan direction can be obtained. A specific repetition rate ofthe laser beam is 10 MHz or more; a frequency band used for the laserbeam is significantly higher than a normally-used frequency band ofseveral tens of hertz to several hundreds of hertz.

In a case of alternatively using a heating furnace for the heattreatment, the amorphous semiconductor layer is heated at 400° C. to550° C. for 2 to 20 hours. At this time, it is preferable to settemperatures at multiple stages in the range of 400° C. to 550° C. sothat the temperature becomes gradually higher. By a low-temperatureheating step at approximately 400° C. at the initial stage, hydrogen orthe like comes out of the amorphous semiconductor layer. Therefore, thesurface roughness of the amorphous semiconductor layer due tocrystallization can be reduced. Further, it is preferable to form ametal element such as Ni which promotes crystallization of silicon overthe amorphous semiconductor layer because the heating temperature can belowered. As the metal element, metal such as Fe, Ru, Rh, Pd, Os, Ir, Pt,Cu, Au, or the like can also be used. In addition to the heat treatment,irradiation with a laser beam using the aforementioned laser may beperformed to form the crystalline semiconductor layer.

Since the metal element which promotes crystallization is a contaminantof a micromachine, the metal element may be removed after thecrystallization. In this case, after crystallization by heat treatmentor laser irradiation, a layer serving as a gettering sink is formed on asemiconductor layer and then heated, thereby moving the metal element tothe gettering sink. A polycrystalline semiconductor layer or asemiconductor layer to which an impurity element is added can be used asthe gettering sink. For example, a polycrystalline semiconductor layerto which an inert element such as argon is added can be formed over thesemiconductor layer and can be used as a gettering sink. When an inertelement is added, distortion can be generated in the polycrystallinesemiconductor layer, and the metal element can be efficiently capturedusing the distortion. Alternatively, the metal element can be capturedby forming a semiconductor layer to which an element such as phosphorusis added. Silicon can be used as a material of the semiconductor layerserving as a gettering sink.

Alternatively, each of the structure layer 108 and the semiconductorlayer 109 may be a silicon layer having minute crystal grains inamorphous silicon. Crystal grains each having a radius of several tensof nanometers to several micrometers can be formed by using a CVD methodand appropriately selecting silicon deposition conditions. Although themethod in which high-density plasma treatment is used to form the firstinsulating layer 107 is explained, the semiconductor layer crystallizedas described above may be subjected to high-density plasma treatment.The high-density plasma treatment can modify the surface of thesemiconductor layer. Accordingly, an interface state can be improved,and electrical properties of the semiconductor element can be improved.

<Formation of Impurity Region>

Next, impurity elements are added to the semiconductor layer 109 whichconstitutes a part of the semiconductor element to form an n-typeimpurity region 110 and a p-type impurity region 111. Further, thestructure layer 108 which constitutes a part of the structure body canbe changed into an n-type impurity region or a p-type impurity region,or an impurity element can be prevented from being added thereto. Here,described is an example of changing the structure layer 108 into ann-type impurity region. The impurity region can be formed by selectivelyforming a resist mask by a photolithography method and adding animpurity element.

The impurity element can be added by an ion doping method or an ionimplantation method. As an impurity element which imparts n-typeconductivity, phosphorus (P) or arsenic (As) is typically used, and asan impurity element which imparts p-type conductivity, boron (B) can beused. It is desirable that an impurity element which imparts n-typeconductivity and an impurity element which imparts p-type conductivityare added to the n-type impurity region and the p-type impurity region,respectively, in a concentration range of 1×10²⁰/cm³ to 1×10²¹/cm³.

After the impurity regions are formed, heat treatment, infrared lightirradiation, or laser light irradiation is carried out to activate theimpurity elements. In particular, effective activation can be carriedout particularly when the impurity elements are activated using anexcimer laser from the front surface or from the backside in anatmosphere at room temperature to 300° C. Such activation can alsorepair plasma damage to the first insulating layer 107 and to aninterface between the first insulating layer 107 and the semiconductorlayer 109. Further, a second harmonic of a YAG laser may be used for theactivation. The irradiation using the YAG laser is a preferableactivation means because the YAG laser requires less maintenance.

Further, a passivation layer of an insulating layer such as a siliconoxynitride layer or a silicon oxide layer may be formed so as to coverthe semiconductor layer 109 and the structure layer 108, so thathydrogenation may be performed. The hydrogenation is to terminatedangling bonds in the semiconductor layer 109, which are generated bythe addition of impurity elements, by hydrogen contained in thepassivation layer. At the same time, the aforementioned impurity regioncan be activated. For example, the semiconductor layer 109 can behydrogenated by forming a silicon oxynitride layer over thesemiconductor layer 109 and the structure layer 108 by a plasma CVDmethod with a thickness of 100 nm and then heating at 300° C. to 550° C.for 1 to 12 hours using a clean oven. Alternatively, the heating may beperformed in a nitrogen atmosphere at 410° C. for one hour.

Through the above steps, an n-type semiconductor element 112 and ap-type semiconductor element 113 are formed (see FIG. 3B). Although then-type semiconductor element 112 and the p-type semiconductor element113 are formed in this embodiment mode, the electric circuit can also beformed using only either of them. When the electric circuit is formedusing either the n-type semiconductor element 112 or the p-typesemiconductor element 113 as described above, the number of reticles(photomasks) used for photolithography can be reduced and the number ofmanufacturing steps can be reduced. Here, transistors, specifically,bottom-gate thin film transistors are formed as the semiconductorelements 112 and 113.

<Second Insulating Layer 114>

Next, a second insulating layer 114 is formed over the n-typesemiconductor element 112, the p-type semiconductor element 113, thestructure layer 108, and the sacrifice layers 104 and 106 (see a lowerdiagram of FIG. 3B). The second insulating layer 114 can be formed of aninorganic compound, an organic compound, or the like having aninsulating property. The second insulating layer 114 may be formed usinga single layer of the above material having an insulating property ormay be formed by stacking two or more layers. This second insulatinglayer 114 functions to insulate the first conductive layer 103 from awiring to be formed thereover and to reduce parasitic capacitance. Thesecond insulating layer 114 can also be used as a part of the structurebody.

The inorganic material used to form the second insulating layer 114 canbe silicon oxide or silicon nitride. The organic material can bepolyimide, acrylic, polyamide, polyimide amide, benzocyclobutene,siloxane, or polysilazane. Note that a siloxane resin refers to a resinhaving a bond of silicon (Si) and oxygen (O). The skeletal structure ofsiloxane is formed from a bond of Si—O—Si. An organic group (forexample, an alkyl group or aromatic hydrocarbon) containing at leasthydrogen or a fluoro group is used as the substituent of the siloxaneresin. Polysilazane is formed using a polymer material having a bond ofsilicon (Si) and nitrogen (N) as a starting material.

<First Contact Hole 115>

Next, the second insulating layer 114 is etched to form a first contacthole 115 (see FIG. 3B). The etching at this time can be carried out byeither dry etching or wet etching. This embodiment mode describes anexample of forming the first contact hole 115 by anisotropic dryetching.

<Second Conductive Layer 116>

Next, a second conductive layer 116 is formed over the second insulatinglayer 114 and the first contact hole 115. The second conductive layer116 can be formed by formation of a layer of a conductive element suchas aluminum (AI), titanium (Ti), molybdenum (Mo), tungsten (W), orsilicon (Si), a compound thereof, or the like and processing of thelayer by a similar method to those of the above-described other layers.The second conductive layer 116 serves as a source electrode and a drainelectrode which are connected to the semiconductor elements 112 and 113,and electrically connects the structure body and the semiconductorelement (see a lower diagram of FIG. 3B. The second conductive layer 116is shown only in the cross-sectional view to make the diagram simpler).

Here, if the second conductive layer 116 has a pattern including a bendand a corner, the corner is preferably processed into a rounded shape.Accordingly, the generation of dust caused by flaking of the corner ofthe layer can be suppressed, and the substrate can be efficientlycleared of dust thereover. This is preferably applied when processing alayer formed of metal or a metal compound or a thick layer, such as thefirst sacrifice layer 104, the second sacrifice layer 106, or the gateelectrode.

At the same time as the steps of forming the first contact hole 115 andthe second conductive layer 116, some processing for forming thestructure body may be carried out. For example, the second insulatinglayer 114 over the first sacrifice layer 104 and the second sacrificelayer 106 can be removed by etching at the same time as formation of thefirst contact hole 115 and the second conductive layer 116 can be formedover the structure layer 108, or a part of the structure layer 108 canbe processed to be thin or removed by etching.

<Opening 117>

Next, an opening 117 is formed in the second insulating layer 114located over the first sacrifice layer 104, the second sacrifice layer106, and the structure layer 108 for sacrifice layer etching (see FIG.4A). The opening 117 can be formed by laser processing, dry etching, wetetching, or the like. This embodiment mode describes an example offorming the opening 117 using anisotropic dry etching similarly to theformation of the first contact hole 115.

The opening 117 is formed to manufacture the structure body by removalof the sacrifice layers. Therefore, the opening 117 is formed byremoving the second insulating layer 114 so as to expose a part of eachof the first sacrifice layer 104 and the second sacrifice layer 106.When an edge portion of the first sacrifice layer 104 and an edgeportion of the structure layer are electrically connected to the secondconductive layer 116 through the first contact hole 115 as shown inFIGS. 4A and 4B, the opening 117 is preferably formed so that theconnection portion and a periphery thereof remain.

<Third Insulating Layer (Protection of Integrated Circuit)>

A third insulating layer can be formed over the second insulating layer114 and the second conductive layer 116 before forming the opening 117in order to protect the semiconductor elements manufactured over thesubstrate. The third insulating layer can be formed of an inorganiccompound, an organic compound, or the like having an insulating property(typically, a photosensitive resin of PI (polyimide), acrylic, or thelike) similarly to the second insulating layer 114. The opening 117 canbe formed after the third insulating layer is formed. This embodimentmode describes an example of not forming the third insulating layer.

<Sacrifice Layer Etching>

Next, the first sacrifice layer 104 and the second sacrifice layer 106are removed by etching through the opening 117 (see a lower diagram ofFIG. 4A). FIG. 4B shows a cross section of FIG. 4A after the sacrificelayer etching taken along a line Q-R in FIG. 4A. By removal of the firstsacrifice layer 104 and the second sacrifice layer 106 through theopening 117 as described above, a movable structure layer 108, and aspatial portion 118 between the substrate and the structure layer areformed; thus, a structure body 119 can be manufactured. The sacrificelayer etching is performed by wet etching or dry etching using asuitable etchant depending on the kind of the sacrifice layer and thestructure layer.

When the first sacrifice layer 104 and the second sacrifice layer 106are formed of, for example, tungsten (W), the sacrifice layer etchingcan be performed by wet etching using an ammonia hydrogen peroxidemixture as an etchant. Here, the ammonia hydrogen peroxide mixture is asolution which is obtained by mixing a 28% ammonia solution and a 31%hydrogen peroxide solution at a ratio of 1:2. When the first sacrificelayer 104 and the second sacrifice layer 106 are formed of a materialincluding silicon dioxide, hydrofluoric acid or buffered hydrofluoricwhich is obtained by mixing a hydrofluoric acid 49% aqueous solutionwith ammonium fluoride at a ratio of 1:7. Although not described in thisembodiment mode, when the first sacrifice layer 104 and the secondsacrifice layer 106 are formed of a material including silicon,phosphoric acid; hydroxide of alkali metal such as KOH, NaOH, or CsOH;NH₄OH; hydrazine; EPD (mixture of ethylenediamine, pyrocatechol, andwater); a tetramethylammonium hydroxide (TMAH) solution; an isopropylalcohol (IPA) solution; or the like can be used.

The above-described step of sacrifice layer etching is necessary tomanufacture the structure body included in a micromachine. Thus, anappropriate combination of materials of the first sacrifice layer 104,the second sacrifice layer 106, and the structure layer 108 (further,various layers therearound), and an etchant for removing the sacrificelayers needs to be selected. When specific materials are selected forthe sacrifice layer and the etchant, the structure layer is formed usinga material, an etching rate of which is lower than that of the sacrificelayer.

In drying after wet etching, rinse is desirably carried out using anorganic solvent with low viscosity (such as isopropyl alcohol orcyclohexane) or drying is desirably carried out at low temperature andlow pressure, in order to prevent buckling that is the attachment of alower surface of the structure layer 108 to the substrate surface due tocapillarity. Further, surface treatment which makes the surface of thestructure body hydrophobic can alternatively be carried out in order toprevent buckling due to capillarity at the time of drying.

The sacrifice layer etching can be carried out by dry etching with theuse of an etching gas such as F₂ or XeF₂ under a condition of highpressure such as atmospheric pressure. In some cases, the lower surfaceof the structure layer may be attached to the substrate surface duringthe operation of the structure body. In order to prevent thisphenomenon, plasma treatment can also be carried out to the surface ofthe structure body after the sacrifice layer etching.

This embodiment mode describes the structure body 119 having a structurein which the first sacrifice layer 104 is formed using a conductivematerial, the first conductive layer 103 and the first sacrifice layer104 are processed in a self-aligned manner, and the first conductivelayer 103 is electrically connected to the second conductive layer 116with the first sacrifice layer 104 interposed therebetween (see FIG.4B). Therefore, a part of the first sacrifice layer 104 remains withoutbeing etched away as shown in FIG. 4B. The part of the first sacrificelayer 104 can be left unetched by controlling the etching rate and thesize of the opening 117.

<Another Structural Example of Structure Body>

In a case where the opening 117 is formed in only the second insulatinglayer 114 which is formed over the first sacrifice layer 104 and thesecond sacrifice layer 106 and the second insulating layer 114 formedover the structure layer 108 is not removed, the structure body can beformed to have a structure layer which is formed by stacking thestructure layer 108 made of a semiconductor layer and the secondinsulating layer 114. Alternatively, the opening 117 can be formed afterthe first contact hole 115 is formed also in the second insulating layer114 over the structure layer 108 when forming the first contact hole 115as described above, the second conductive layer 116 is formed over thestructure layer 108. By formation of the opening 117 so as to leave thesecond insulating layer 114 which is formed over the structure layer108, a structure layer in which the structure layer 108 made of asemiconductor layer, the second conductive layer 116, and the secondinsulating layer 114 are stacked can be formed. On the other hand, byformation of the opening 117 so as to remove the second insulating layer114 which is formed over the structure layer 108, a structure layer inwhich the structure layer 108 made of a semiconductor layer and thesecond conductive layer 116 are stacked can be formed.

<Opposite Substrate>

In order to seal the micromachine manufactured as described above orform a multilayer wiring, an opposite substrate can be attached. Here,the opposite substrate refers to a substrate which is attached so as toface the substrate 101 provided with the structure body 119 and thesemiconductor elements 112 and 113. The opposite substrate can be aninsulating substrate such as a glass substrate, a quartz substrate, or aplastic substrate similarly to the substrate 101.

Sealing with the opposite substrate can protect the micromachine fromcontamination and impact and maintain internal pressure and gas constantso as to make the micromachine operate. Further, in a case where themicromachine includes a plurality of electric circuits and structurebodies, and only the second conductive layer 116 is insufficient forwiring connection or the micromachine is desired to be miniaturized bymultilayer interconnection, the opposite substrate can be provided witha third conductive layer and attached to the substrate.

For example, an opposite substrate 120 is provided with a thirdconductive layer 121 as shown in FIG. 5A. The third conductive layer 121can be formed by forming a film of a conductive metal element or acompound thereof and processing the film similarly to the secondconductive layer 116 or the like. In addition, the opposite substrate120 may be provided with a base layer 122 when the opposite substrate120 is provided with the third conductive layer 121. This base layer 122can be formed using a similar material and a similar method to those ofthe base layer 102 which is formed over the substrate 101.

Then, the substrate 101 provided with the structure body and thesemiconductor elements is attached to the opposite substrate 120provided with the third conductive layer 121 (see FIG. 5B). In order toelectrically connect the second conductive layer 116 to the thirdconductive layer 121, the substrate 101 can be attached to the oppositesubstrate 120 by using an anisotropic conductive material 123 which hasconductivity only in the attachment direction (the directionperpendicular to the substrate).

The anisotropic conductive material 123 can be an anisotropic conductivepaste (ACP) that is cured by heat or an anisotropic conductive film(ACF) that is cured by heat, either of which has conductivity only in aspecific direction (here, the direction perpendicular to the substrate).The anisotropic conductive paste is called a binder layer and has astructure in which particles each having a conductive surface(hereinafter referred to as conductive particles) are dispersed in alayer which includes an adhesive as its main component. The anisotropicconductive film has a structure in which particles each having aconductive surface (hereinafter referred to as conductive particles) aredispersed in a thermosetting or thermoplastic resin film. Note that theparticle having a conductive surface used here is a spherical resinplated with nickel (Ni), gold (Au), or the like. Insulating particles ofsilica or the like may be mixed in order to prevent an electrical shortcircuit between the conductive particles in an unnecessary portion. Whenthe opposite substrate is provided with only an insulating layer, thesubstrate can be attached to the opposite substrate using anonconductive adhesive.

When the micromachine performs wireless communication, the micromachinecan be provided with an antenna using the opposite substrate 120.Specifically, the antenna is formed by forming and processing aconductive layer over the opposite substrate 120. In this case, theopposite substrate 120 may be provided with the base layer 122. Themicromachine can be manufactured by attaching the substrate 101 to theopposite substrate 120 so as to electrically connect the secondconductive layer 116 to the antenna similarly to the opposite substrate120 provided with the third conductive layer 121.

Through the above steps, the micromachine which includes the structurebody and the semiconductor element over one substrate can bemanufactured. The structure body thus manufactured can function as, forexample, an actuator that operates by electrostatic attraction byvoltage application between the first conductive layer 103 and thestructure layer 108. Alternatively, the structure body can be used as asensor by detection of a change in height of the spatial portion 118 dueto application of external force such as pressure to the structure layer108.

As described above, the micromachine of the present invention does notrequire assembly and packaging steps because the structure body and thesemiconductor element are manufactured over one substrate. Further, themicromachine can be miniaturized by manufacturing of them over onesubstrate and by formation and connection of a conductive layer with theuse of an opposite substrate.

(Embodiment Mode 2)

This embodiment mode describes an example of manufacturing amicromachine which includes a structure body and a semiconductor elementover one substrate by using a method different from that in the aboveembodiment mode. A micromachine and its manufacturing method of thisembodiment mode are described with reference to FIGS. 6A to 9D. Some ofthe drawings each include a diagram showing a top view of a substrate onan upper side and a cross-sectional view of a top view along a line O-Pon a lower side.

<Substrate 201, Base Layer 202, First Conductive Layer 203, SacrificeLayers 204 and 206, Gate Electrode 205, and First Insulating Layer 207>

The micromachine of this embodiment mode can be manufactured over aninsulating substrate similarly to Embodiment Mode 1. Similarly to thebase layer 102, the first conductive layer 103, the first sacrificelayer 104, the gate electrode 105, the second insulating layer 114, andthe first insulating layer 107 of Embodiment Mode 1, a base layer 202, afirst conductive layer 203, a first sacrifice layer 204, a gateelectrode 205, a second sacrifice layer 206, and a first insulatinglayer 207 are formed over a substrate 201. The first insulating layer207 functions as a gate insulating layer in a semiconductor element (seeFIG. 6A).

<Semiconductor Layer (Semiconductor Layer 209, First Structure Layer208)>

Next, a semiconductor layer is formed over the first insulating layer207 and processed into an arbitrary shape, thereby forming a firststructure layer 208 which constitutes a part of a structure body and asemiconductor layer 209 which constitutes a part of a semiconductorelement. The semiconductor layer can be formed using a materialincluding silicon as in the above embodiment mode. This embodiment modedescribes an example of forming the semiconductor layer using anamorphous semiconductor or an amorphous semiconductor including minutecrystal grains, unlike in Embodiment Mode 1. First, a firstsemiconductor layer 210 which includes an amorphous semiconductor or anamorphous semiconductor including minute crystal grains is formed overthe first insulating layer 207. These semiconductors can be deposited bya CVD method, and crystal grains each having a radius of several tens ofnanometers to several micrometers can be formed by appropriatelyselecting a silicon deposition condition.

Next, a second semiconductor layer 211 having an amorphous structure towhich an impurity imparting n-type conductivity or an impurity impartingp-type conductivity is added is formed over the semiconductor layerformed in the above step. As the impurity imparting n-type conductivity,phosphorus (P) or arsenic (As) can be typically used, and as theimpurity imparting p-type conductivity, boron (B) can be used. It isdesirable that an impurity element is added to the semiconductorincluding the impurity within a concentration range of 1×10²⁰/cm³ to1×10²¹/cm³. This embodiment mode describes an example of forming anamorphous semiconductor layer to which the impurity imparting n-typeconductivity is added as the second semiconductor layer 211.

Then, the first semiconductor layer 210 and the second semiconductorlayer 211 formed in the above step are processed into a predeterminedshape, thereby forming the first structure layer 208 which constitutes apart of the structure body and the semiconductor layer 209 whichconstitutes a part of the semiconductor element (see FIG. 6B). The firststructure layer 208 and the semiconductor layer 209 can be processed byphotolithography and etching similarly to the method described inEmbodiment Mode 1.

The thicknesses of the first semiconductor layer 210 and the secondsemiconductor layer 211 forming the first structure layer 208 aredetermined by considering various factors similarly to the casedescribed in Embodiment Mode 1. Since a plurality of semiconductorlayers is stacked in this embodiment mode, the thicknesses arepreferably determined by considering their mechanical strength, internalstress, and the like.

Subsequently, a second conductive layer 212 is formed over the secondsemiconductor layer 211 which is formed of an amorphous semiconductorlayer to which an impurity imparting n-type conductivity or an impurityimparting p-type conductivity is added (in this embodiment mode, theamorphous semiconductor to which the impurity imparting n-typeconductivity is added). The second conductive layer 212 can be formed byforming and processing a layer of a conductive metal element, a compoundthereof, or the like similarly to Embodiment Mode 1. In this embodimentmode, the second conductive layer 212 which is formed over the firststructure layer 208 is referred to as a second structure layer when itfunctions as a structure layer.

Since the second conductive layer 212 is a conductive layer connected toa source electrode or a drain electrode of the semiconductor element orthe structure layer, it can be processed so as to form electricalconnection relationship for forming the micromachine. In this case, thesecond conductive layer 212 is not formed over a portion which serves asa channel region of the semiconductor element. Then, the secondsemiconductor layer 211 and the first semiconductor layer 210 are partlyremoved by etching with the use of the second conductive layer 212 as amask, thereby forming a channel region 213 of the semiconductor element(see FIG. 7A). In this embodiment mode, an n-type semiconductor element214 is formed through the above steps (see FIG. 7A). Here, a transistoris formed as the semiconductor element 214. The transistor is aninverted staggered thin film transistor with a channel etch structure.

<Second Insulating Layer 215>

Next, a second insulating layer 215 is formed so as to cover the n-typesemiconductor element 214 and a portion to be the structure body (see alower diagram of FIG. 7B). The second insulating layer 215 can be formedusing an insulating inorganic compound, organic compound, or the likesimilarly to the method described in the above embodiment mode.

<First Contact Hole 216>

Next, the second insulating layer 215 is etched to form a first contacthole 216 (see an upper diagram of FIG. 7B). The etching treatment atthis time can be performed by dry etching or wet etching. Thisembodiment mode describes an example of forming the first contact hole216 by anisotropic dry etching.

<Third Conductive Layer 217 (Wiring)>

Then, a third conductive layer 217 is formed over the second insulatinglayer 215 and in the first contact hole 216. The third conductive layer217 can be formed by forming a layer of a conductive metal element or acompound thereof and processing the layer into a predetermined shapesimilarly to the second conductive layer 212 and the method described inthe above embodiment mode. The second conductive layer 212 can beelectrically connected to the source electrode and the drain electrodeof the semiconductor element, but not to the gate electrode. Therefore,the source electrode or the drain electrode can be connected to the gateelectrode using the third conductive layer 217.

At the same time as the steps of forming the first contact hole 216 andthe third conductive layer 217, some processing for forming thestructure body may be performed. For example, a part of the secondinsulating layer 215 over the first sacrifice layer 204, the secondsacrifice layer 206, the first structure layer 208, and the secondstructure layer (the second conductive layer 212) may also be removed byetching at the time of forming the first contact hole 216. Thus, thethird conductive layer 217 can be formed thereover. In addition, theprocessing of removing a part of the second conductive layer 212 formedover the structure layer 208 can also be performed.

<Opening 218>

Next, an opening 218 is formed in the second insulating layer 215similarly to the above embodiment mode for sacrifice layer etching (seeFIG. 8A). The opening 218 can be formed by laser processing, dryetching, wet etching, or the like. Here, the opening 218 is formed inorder to remove the sacrifice layers and manufacture the structure body.Therefore, as described in Embodiment Mode 1 with reference to FIGS. 4Aand 4B, when an edge portion of the first sacrifice layer 204, an edgeportion of the structure layer 208, and the second conductive layer 212are electrically connected to the third conductive layer 217 through thefirst contact hole 216, the opening 218 is preferably formed so that theconnection portion and a periphery thereof remain.

Similarly to Embodiment Mode 1, a third insulating layer can be formedover the second insulating layer 215 and the third conductive layer 217before forming the opening 218, in order to protect the semiconductorelement formed over the substrate.

<Sacrifice Layer Etching>

Next, similarly to the above embodiment mode, the first sacrifice layer204 and the second sacrifice layer 206 are removed by etching throughthe opening 218 (see a lower diagram of FIG. 8A). By removal of thesacrifice layers through the opening 218 as described above, a structurebody 221 can be manufactured to have a structure layer 219 which is astack of the first structure layer 208 and the second structure layer(second conductive layer 212) and is movable, and a spatial portion 220between the substrate and the structure layer.

Alternatively, sacrifice layer etching can be performed through anopening which is formed in the second insulating layer 215 over thefirst sacrifice layer 204 and the second sacrifice layer 206 as shown inFIG. 8B. When the opening 218 is provided so as to leave the secondinsulating layer 215 over the first structure layer 208 and the secondstructure layer (second conductive layer 212) as shown, the structurebody 221 can be formed to have the structure layer 219 which is a stackof the first structure layer 208, the second structure layer (secondconductive layer 212), and the second insulating layer 215, and thespatial portion 220 between the structure layer 219 and the substrate201 (see a lower diagram of FIG. 8B).

The structure body 221 can be processed into various shapes throughfinal processing, for example, formation of the opening 218, subsequentetching processing, or the like. For example, when the sacrifice layeretching is performed after providing the opening 218 over the structurelayer 219 similarly to the case shown in FIG. 8A, the shape of thestructure body 221 can be changed depending on whether an opening 222 isformed to be smaller as shown in FIG. 9A or to be larger as shown inFIG. 9B. In specific, when the opening 222 is formed to be small asshown in FIG. 9A, a brace portion 223 of the structure body having abeam structure is fixed to the second insulating layer 215. In thiscase, the structure layer 219 has a higher spring constant and becomesless fragile because it is fixed to the second insulating layer 215. Incontrast, when the opening 222 is formed to be large as shown in FIG.9B, the brace portion 223 of the structure body is separated from thesecond insulating layer 215 and becomes thinner. Thus, the structurelayer 219 has a smaller spring constant than the above structure andbecomes more movable.

Further, after forming the opening 218 in the second insulating layer215, a part of the second structure layer (second conductive layer 212)over the first structure layer 208 can be removed by etching as shown inFIG. 9C. Accordingly, the structure layer 219 can be formed by only thefirst structure layer 208, and the structure layer 219 can be formed tohave flexibility unique to silicon.

When the structure layer 219 is formed by only a semiconductor asdescribed above, a method, by which the second structure layer (secondconductive layer 212) is not formed over the first structure layer 208,can be employed. In this case, the first structure layer 208 is formedafter formation of the first semiconductor layer 210 and the secondsemiconductor layer 211, and the second conductive layer 212 is notformed over the first structure layer 208. Thus, at the time of formingthe channel region of the semiconductor element, the secondsemiconductor layer 211 to which an impurity is added is removed byetching. Therefore, the structure layer 219 of the structure body shownin FIG. 9D is thinner than the structure layer 219 shown in FIG. 9C, anda structure body with high movability can be manufactured.

Further, as described in Embodiment Mode 1, an opposite substrate can beattached to seal the manufactured micromachine or form a multilayerwiring.

Through the above steps, a micromachine which includes a structure bodyand a semiconductor element over one substrate can be manufactured. Themicromachine of this embodiment mode does not require assembly andpackaging steps because the structure body and the semiconductor elementare manufactured over one substrate. Further, the micromachine can beminiaturized by manufacturing of them over one substrate and byformation and connection of a conductive layer with the use of anopposite substrate.

Note that this embodiment mode can be freely combined with EmbodimentMode 1.

(Embodiment Mode 3)

This embodiment mode describes an example of manufacturing amicromachine which includes a structure body and an electric circuithaving a semiconductor element over one substrate by using a methoddifferent from those in Embodiment Modes 1 and 2. A micromachine and itsmanufacturing method of this embodiment mode are described withreference to cross-sectional views shown in FIGS. 10 to 20C. Eachdrawing shows a structure body on the left side (a region 312 where astructure body is to be manufactured) and a semiconductor element on theright side (a region 313 where a semiconductor element is to bemanufactured). In this embodiment mode, a thin film transistor whichincludes gate electrodes above and below a semiconductor layer is formedas the semiconductor element. This embodiment mode describes an exampleof manufacturing two semiconductor elements in the region 313 where asemiconductor element is to be manufactured. A left semiconductorelement is an n-channel transistor and a right semiconductor element isa p-channel transistor.

This embodiment mode describes an example of manufacturing the structurebody at the same time as manufacturing the semiconductor elements eachincluding gate electrodes above and below a semiconductor layer.Therefore, in the manufacturing method of the micromachine of thisembodiment mode, a base layer 302, a first conductive layer 303, a firstinsulating layer 304, a semiconductor layer 305, a second insulatinglayer 306, and a second conductive layer 307 are formed over a substrate301, and an impurity is then added to the semiconductor layer, therebymanufacturing the semiconductor elements as shown in FIG. 10. Then, athird insulating layer 310 is formed, a first contact hole is formed inthe third insulating layer, and a third conductive layer 311 is formed.FIG. 10 shows a basic cross-sectional view of layers which are stackedin this embodiment mode, before carrying out sacrifice layer etching.

After that, an opening is formed in the third insulating layer 310, anda sacrifice layer is removed by sacrifice layer etching, therebymanufacturing a structure body including a structure layer and a spatialportion. In the manufacturing method of the micromachine of thisembodiment mode, each layer may be formed by using a single layer orstacking layers. In particular, a structure layer, a conductive layerfor forming a structure body, and a sacrifice layer can be separatelyformed in various ways depending on a stacked structure of the firstconductive layer 303 and the second conductive layer 307.

This embodiment mode describes first an example of a method formanufacturing the above basic structure, and then several examples ofseparate formation depending on stacking relationship.

The micromachine of the present invention can be manufactured over aninsulating substrate similarly to Embodiment Modes 1 and 2. The baselayer 302 is formed over the substrate 301 similarly to the base layer102 of Embodiment Mode 1.

Next, the first conductive layer 303 is formed over the base layer 302.The first conductive layer 303 in the region 312 where a structure bodyis to be formed is used as a layer which constitutes a part of thestructure body, and a sacrifice layer. On the other hand, the firstconductive layer 303 in the region 313 where a semiconductor element isto be formed serves as a first gate electrode. The first conductivelayer 303 can be formed by forming and processing a film of a conductivematerial similarly to the above embodiment modes. The first conductivelayer 303 can also be processed to have a taper angle as shown.

Next, the first insulating layer 304 is formed over the first conductivelayer 303. The first insulating layer 304 in the region 313 where asemiconductor element is to be formed serves as a gate insulating layer.The first insulating layer 304 may be formed using a material includingsilicon, such as silicon oxide or silicon nitride by a plasma CVDmethod, a sputtering method, or the like as described in the aboveembodiment modes. Further, it can also be formed using metal oxide ormetal nitride which is formed by oxidizing or nitriding the surface ofthe first conductive layer 303 by plasma treatment, an anodic oxidationmethod, or the like. By oxidation or nitridation of the metal surface, auniform layer can be formed.

Next, the semiconductor layer 305 is formed over the first insulatinglayer 304. The semiconductor layer 305 may be formed by forming a layerincluding silicon and then crystallizing the layer by thermalcrystallization as described in Embodiment Mode 1. Alternatively, it maybe formed by stacking a plurality of semiconductor layers as describedin Embodiment Mode 2. This embodiment mode describes an example offorming the semiconductor layer 305 by film formation, crystallization,and impurity addition similarly to Embodiment Mode 1. FIG. 10 shows anexample of forming two types of semiconductor elements by forming afirst impurity region 308 to which an impurity imparting n-typeconductivity is added and a second impurity region 309 to which animpurity imparting p-type conductivity is added. The semiconductor layer305 in the region 312 where a structure body is to be formed is used asa layer which constitutes a part of the structure body, and a sacrificelayer.

Next, the second insulating layer 306 is formed over the firstinsulating layer 304 and the semiconductor layer 305. The secondinsulating layer 306 in the region 313 where a semiconductor element isto be formed serves as a gate insulating layer. The second insulatinglayer 306 can be formed using a material including silicon such assilicon oxide or silicon nitride by a plasma CVD method, a sputteringmethod, or the like similarly to the first insulating layer 304.

Then, the second conductive layer 307 is formed over the secondinsulating layer 306. The second conductive layer 307 can be formedsimilarly to the first conductive layer 303. The second conductive layer307 in the region 312 where a structure body is to be formed is used asa layer which constitutes a part of the structure body, and a sacrificelayer. On the other hand, the second conductive layer 307 in the region313 where a semiconductor element is to be formed serves as a secondgate electrode.

Next, the third insulating layer 310 is formed over the secondinsulating layer 306 and the second conductive layer 307. The thirdinsulating layer 310 functions to reduce parasitic capacitance byinsulating the semiconductor element from a wiring to be formedthereover, and can be formed using an insulating inorganic compound,organic compound, or the like similarly to the methods described in theabove embodiment modes.

Next, the third insulating layer 310 is etched, thereby forming a firstcontact hole. The etching treatment at this time can be performed by dryetching or wet etching.

Next, the third conductive layer 311 is formed using a conductive metalelement or a compound thereof over the third insulating layer 310 and inthe first contact hole. The third conductive layer 311 in the regionwhere a semiconductor element is to be formed serves as a wiring forconnecting a source electrode, a drain electrode, and a gate electrode.In addition, the third conductive layer 311 may also serve as a wiringfor connecting the structure body and the semiconductor element to eachother.

Each of the layers formed as described above can be formed by using asingle layer of a single material or by stacking layers of a pluralityof materials.

Each of the layers formed in the above steps can be processed by etchingusing as a mask a photosensitive resist which is applied over the layerand processed into an arbitrary shape by a photolithography method. Thisetching step may be performed by either dry etching using a gas etchantor wet etching using a liquid etchant, which is preferably selectedappropriately depending on film formation and processing conditions. Forexample, anisotropic dry etching can be employed in a case of forming aconductive layer or a contact hole, whereby the layer can be processedperpendicularly. In sacrifice layer etching, isotropic wet etching canbe employed to remove the sacrifice layer located below the structurelayer.

In a case of stacking layers of a plurality of materials, the layers maybe formed by repeating film formation and processing. Alternatively, aplurality of layers may be successively formed and then processedsimultaneously in a self-aligned manner.

Described next are several examples of methods for separately formingstructure bodies having different structures by stacking the firstconductive layer 303 and the second conductive layer 307 in variousways.

<Structural Example 1 of Structure Body>

A first example is shown in FIGS. 11A to 11C. In this example, the firstconductive layer 303 is formed with a single-layer structure, and thesecond conductive layer 307 is formed with a stacked structure of twolayers, upper and lower layers, as shown in FIG. 11A. The firstconductive layer 303 and the upper layer of the second conductive layer307 serve as sacrifice layers. Then, an opening is formed by removingthe third insulating layer 310 in the region 312 where a structure bodyis to be formed, and sacrifice layer etching is carried out.Accordingly, a structure body which includes a spatial portion 314 belowthe semiconductor layer 305 can be formed as shown in FIG. 11B.Alternatively, an opening may be formed in a portion which is over thefirst conductive layer 303 and the second conductive layer 307 but notover the semiconductor layer 305. Accordingly, a structure bodyincluding spatial portions 314 above and below the semiconductor layer305 can be formed as shown in FIG. 11C.

In this example, a structure layer which is a stack of the firstinsulating layer 304, the semiconductor layer 305, the second insulatinglayer 306, and the lower layer of the second conductive layer 307 can beformed. Since such a structure layer has a stacked structure of aconductive layer and an insulating layer, it is movable like bimetalwhen a current flows through the conductive layer utilizing, forexample, a difference in thermal expansion coefficient. In addition, thestructure layer can be used for a structure body which detects warpageof the structure layer due to external force by detecting a change inresistance of the conductive layer.

<Structural Example 2 of Structure Body>

Next, a second example is shown in FIGS. 12A and 12B. In this example,the first conductive layer 303 is formed with a single-layer structure,the second conductive layer 307 is formed with a single-layer or stackedstructure as shown in FIG. 12A, and the semiconductor layer 305 is usedas a sacrifice layer. Then, an opening is formed by removing the thirdinsulating layer 310 in the region where a structure body is to beformed, and sacrifice layer etching is performed. Accordingly, astructure body which includes the spatial portion 314 between the firstconductive layer 303 and the second conductive layer 307 can be formedas shown in FIG. 12B. In the structure body formed as described above,the first conductive layer 303 serves as a fixed electrode, the secondinsulating layer 306 and the second conductive layer 307 serve as astructure layer, and the second conductive layer 307 serves as a movableelectrode.

FIGS. 12A and 12B show a case where the second conductive layer 307 hasa stacked structure of two layers, an upper layer and a lower layer. Astructure body with arbitrary hardness can be faulted by stacking ofdifferent kinds of materials. However, the structure body is not limitedto this example, and the second conductive layer 307 may be formed usinga single layer of a single material or stacking layers of a plurality ofmaterials.

<Structural Example 3 of Structure Body>

A third example is shown in FIGS. 13A and 13B. In this example, thefirst conductive layer 303 is formed with a single layer, and the secondconductive layer 307 is formed with two layers, an upper layer and alower layer, as shown in FIG. 13A, and the lower layer of the secondconductive layer 307 is used as a sacrifice layer. Then, an opening isformed by removing the third insulating layer 310 and the secondconductive layer 307 except in the region where a structure body is tobe formed, and sacrifice layer etching is carried out. Accordingly, astructure body which includes the spatial portion 314 can be formed asshown in FIG. 13B. In the structure body formed as described above, thefirst conductive layer 303 serves as a fixed electrode, and the upperlayer of the second conductive layer 307 and the third insulating layer310 serve as a structure layer.

In addition, FIGS. 13A and 13B show an example of forming a structurebody in which the upper layer of the second conductive layer 307 formsthe structure layer by changing the method for forming the secondconductive layer 307. In this case, the upper layer and the lower layerof the second conductive layer 307 may be separately formed andprocessed so that the upper layer of the second conductive layer 307covers the lower layer.

<Structural Example 4 of Structure Body>

A fourth example is shown in FIGS. 14A and 14B. In this example, thefirst conductive layer 303 is formed with two layers, an upper layer anda lower layer, and the second conductive layer 307 is formed with asingle layer as shown in FIG. 14A, and the upper layer of the firstconductive layer 303 is used as a sacrifice layer. Then, an opening isformed by removing the third insulating layer 310 in the region 312where a structure body is to be formed, and sacrifice layer etching iscarried out. Accordingly, a structure body which includes the spatialportion 314 can be formed as shown in FIG. 14B. In the structure bodyformed as described above, the lower layer of the first conductive layer303 serves as a fixed electrode, and the first insulating layer 304, thesemiconductor layer 305, the second insulating layer 306, and the secondconductive layer 307 serve as a structure layer.

<Structural Example 5 of Structure Body>

A fifth example is shown in FIGS. 15A and 15B. In this example, each ofthe first conductive layer 303 and the second conductive layer 307 isformed with two layers, an upper layer and a lower layer, as shown inFIG. 15A, and the upper layer of the first conductive layer 303 and theupper layer of the second conductive layer 307 are used as sacrificelayers. Then, an opening is formed by removing the third insulatinglayer 310 in the region where a structure body is to be formed, andsacrifice layer etching is carried out. Accordingly, a structure bodycan be formed. In the structure body formed as described above, thelower layer of the first conductive layer 303 serves as a fixedelectrode, and the first insulating layer 304, the semiconductor layer305, the second insulating layer 306, and the lower layer of the secondconductive layer 307 serve as a structure layer. Alternatively, anopening may be formed by removing the third insulating layer 310 exceptin the region where a structure body is to be formed, and sacrificelayer etching may be carried out. Accordingly, a structure body whichincludes the spatial portions 314 above and below the structure layercan be formed as shown in FIG. 15B.

<Structural Example 6 of Structure Body>

A sixth example is shown in FIGS. 16A and 16B. In this example, thefirst conductive layer 303 is formed with two layers, an upper layer anda lower layer, and the second conductive layer 307 is formed with asingle layer as shown in FIG. 16A, and the lower layer of the firstconductive layer 303 and the second conductive layer 307 are used assacrifice layers. Then, an opening is formed by removing the thirdinsulating layer 310 except in the region where a structure body is tobe formed, and sacrifice layer etching is carried out. Accordingly, astructure body which includes the spatial portions 314 above and belowthe structure layer can be formed as shown in FIG. 16B. In the structurebody formed as described above, there is no fixed electrode, and theupper layer of the first conductive layer 303, the first insulatinglayer 304, the semiconductor layer 305, and the second insulating layer306 serve as a structure layer. Alternatively, also in this example, anopening may be formed by removing the third insulating layer 310 overthe structure layer, and sacrifice layer etching may be carried out,thereby forming a structure body.

<Structural Example 7 of Structure Body>

A seventh example is shown in FIGS. 17A and 17B. In this example, thefirst conductive layer 303 and the second conductive layer 307 areformed as shown in FIG. 17A similarly to Structural Example 6, and thelower layer of the first conductive layer 303 is used as a sacrificelayer. Then, an opening is formed by removing the third insulating layer310 in the region where a structure body is to be formed, and sacrificelayer etching is carried out. Accordingly, a structure body whichincludes the spatial portion 314 below the structure layer can be formedas shown in FIG. 17B.

In the structure body formed as described above, there is no fixedelectrode, and the upper layer of the first conductive layer 303, thefirst insulating layer 304, the semiconductor layer 305, the secondinsulating layer 306, and the second conductive layer 307 serve astructure layer. For example, the structure body formed as describedabove can detect the movement of the structure layer according to adifference in strain between the upper and lower conductive layers whenthe upper layer of the first conductive layer 303 and the secondconductive layer 307 are formed using materials having different gaugefactors. Further, the structure body can be used as an actuator whenbimetal is formed using materials with different thermal expansioncoefficients.

<Structural Example 8 of Structure Body>

An eighth example is shown in FIGS. 18A and 18B. In this example, thefirst conductive layer 303 is formed with three layers, an upper layer,an intermediate layer, and a lower layer, the second conductive layer307 is formed with a single layer or a stacked layer as shown in FIG.18A, and the intermediate layer of the first conductive layer 303 isused as a sacrifice layer. Then, an opening is formed by removing thethird insulating layer 310 in the region where a structure body is to beformed, and sacrifice layer etching is carried out. Accordingly, astructure body which includes the spatial portion 314 below thestructure layer can be formed as shown in FIG. 18B. In the structurebody formed as described above, the lower layer of the first conductivelayer 303 serves as a fixed electrode, and the upper layer of the firstconductive layer 303, the first insulating layer 304, the semiconductorlayer 305, the second insulating layer 306, and the second conductivelayer 307 serve a structure layer.

<Structural Example 9 of Structure Body>

A ninth example is shown in FIGS. 19A and 19B. In this example, thefirst conductive layer 303 and the second conductive layer 307 areformed similarly to Structural Example 8 as shown in FIG. 19A, and theintermediate layer of the first conductive layer 303 and the secondconductive layer 307 are used as sacrifice layers. Then, an opening isformed by removing the third insulating layer 310 except in the regionwhere a structure body is to be formed, and sacrifice layer etching iscarried out. Accordingly, a structure body which includes the spatialportions 314 above and below the structure layer can be formed as shownin FIG. 19B. In the structure body formed as described above, the lowerlayer of the first conductive layer 303 serves as a fixed electrode, andthe upper layer of the first conductive layer 303, the first insulatinglayer 304, the semiconductor layer 305, and the second insulating layer306 serve as a structure layer. In this example, an opening mayalternatively be formed by removing the third insulating layer 310 inthe region where a structure body is to be formed, and sacrifice layeretching may be carried out. Accordingly, a structure body which includesthe spatial portion 314 below the structure layer can be formed.

<Structural Example 10 of Structure Body>

Lastly, a tenth example is shown in FIGS. 20A to 20C. In this example,the first conductive layer 303 is formed with three layers, an upperlayer, an intermediate layer, and a lower layer, and the secondconductive layer 307 is formed with two layers, an upper layer and alower layer as shown in FIG. 20A, and the intermediate layer of thefirst conductive layer 303 and the upper layer of the second conductivelayer 307 are used as sacrifice layers. Then, an opening is formed byremoving the third insulating layer 310 except in the region where astructure body is to be formed, and sacrifice layer etching isperformed. Accordingly, a structure body which includes the spatialportions 314 above and below the structure layer can be formed as shownin FIG. 20B. Alternatively, an opening may be formed by removing thethird insulating layer 310 in the region where a structure body is to beformed, and sacrifice layer etching may be performed. Accordingly, astructure body which includes the spatial portion 314 below thestructure layer can be formed as shown in FIG. 20C. In the structurebody manufactured as described above, the lower layer of the firstconductive layer 303 serves as a fixed electrode, and the upper layer ofthe first conductive layer 303, the first insulating layer 304, thesemiconductor layer 305, the second insulating layer 306, and the lowerlayer of the second conductive layer 307 serve as a structure layer.

In a case of forming a thick sacrifice layer in the above structuralexamples 1 to 10, layers used as sacrifice layers can be formed andprocessed in two or more stages. In a case of forming sacrifice layersin a plurality of stages or forming a plurality of sacrifice layers, thesacrifice layers are preferably made of the same material or materialswhich can be etched by the same method. When a plurality of sacrificelayers is formed of the same material, sacrifice layer etching forforming a structure body can be carried out at a time. Accordingly, thenumber of steps can be reduced, and the cost for forming a micromachinecan be reduced. Note that different materials can be used depending onconditions such as adhesiveness to layers formed above and below. Inthis case, sacrifice layer etching for forming a structure body may becarried out twice.

The thickness of the sacrifice layer is determined by consideringvarious factors such as a material of the sacrifice layer, a structureand an operation method of the structure body, and a method of sacrificelayer etching. If the sacrifice layer is too thin, there is a problem inthat an etchant is not diffused and the sacrifice layer is not etched.Further, when the sacrifice layer is thin, buckling of the structurelayer occurs after etching. In a case of operating the structure body byelectrostatic attraction, the distance between a fixed electrode and amovable electrode is increased if the sacrifice layer is too thick;therefore, it becomes impossible to operate the structure body. In acase of operating the structure body by electrostatic attraction, forexample, the sacrifice layer preferably has a thickness of 0.5 μm to 4μm, more preferably 1 μm to 2.5 μm.

Layers adjacent to the sacrifice layer, for example, the firstinsulating layer and the second insulating layer are preferably formedusing a material which is hardly etched when sacrifice layer etching iscarried out. Even if it is hard to obtain selectivity between thesacrifice layer and the semiconductor layer, sacrifice layer etching canbe easily performed by protection of the semiconductor layer with thefirst insulating layer and the second insulating layer.

On the other hand, the first insulating layer and the second insulatinglayer forming the structure layer can be removed if they areunnecessary. For example, each insulating layer can be processed into anarbitrary shape by photolithography and etching at the time offormation. Alternatively, the insulating layers can be removed aftersacrifice layer etching.

The structures of the structure bodies described in this embodiment modeare mere examples, and the method for forming a semiconductor elementand a structure body at the same time is not limited to the aboveexamples. For example, a structure layer can be formed using the thirdinsulating layer and the third conductive layer.

Note that this embodiment mode can be freely combined with either of theabove-described embodiment modes.

(Embodiment Mode 4)

This embodiment mode describes an example of a method for forming astructure layer of a semiconductor layer, like the structure layer 108described in Embodiment Mode 1 with reference to FIGS. 1A to 4B and thestructure layer 208 described in Embodiment Mode 2 with reference toFIGS. 5A to 9D.

FIGS. 21A to 21E show structure bodies formed of semiconductor layers.For example, a structure layer of a structure body 400 can be formed bystacking a layer 401 including polycrystalline silicon which iscrystallized using the above steps and a layer 402 including amorphoussilicon as shown in FIG. 21A. In each of FIGS. 21A to 21E, a referencenumeral 410 denotes a substrate having an insulating surface.

Silicon layers having different crystal states, like the layer includingpolycrystalline silicon and the layer including amorphous silicon in theabove example, have different mechanical characteristics. Therefore, astructure body appropriate for various applications can be manufacturedby formation of the structure layer by stacking layers as described inthe above example or in a selective region.

<Measurement of Complex Elastic Modulus and Indentation Hardness>

In order to examine the difference in mechanical characteristics betweensilicon layers having different crystal states, measurement is conductedon complex elastic modulus and indentation hardness of a layer includingamorphous silicon formed by a CVD method and a layer includingpolycrystalline silicon. Here, the layer including polycrystallinesilicon is obtained by crystallizing a layer including amorphous siliconthrough laser crystallization using a metal catalyst.

The layer including amorphous silicon used as a sample is an amorphoussilicon layer formed over a base layer that is a 50-nm-thick siliconnitride layer and a 100-nm-thick silicon oxide layer formed over aquartz substrate by a CVD method. The amorphous silicon layer is formedby a CVD method.

The layer including polycrystalline silicon used as a sample is a layerobtained by crystallizing a layer including amorphous silicon formedsimilarly to the above description with the use of a continuous wavelaser. Here, a laser beam used for crystallization is a second harmonicof a Nd:YVO₄ layer with an energy density of 9 W/cm² to 9.5 W/cm² and ascan speed of 35 cm/sec.

Here, the sample layer including amorphous silicon is formed with athickness of 66 nm, and the thickness of the layer includingpolycrystalline silicon crystallized by laser irradiation isapproximately 60 nm.

Measurement is conducted by nanoindentation measurement in which anindenter with a triangular pyramid shape is pressed into a sample. Acondition for the measurement is a single press of an indenter and theindenter used is a Berkovich indenter made of diamond. Therefore, theelastic modulus of the indenter is about 1000 GPa with a Poisson's ratioof about 0.1.

The complex elastic modulus that is measured is obtained by combiningthe elastic modulus of the sample and that of the indenter, which isexpressed by the following formula (1). In the formula (1), Er is acomplex elastic modulus, E is Young's modulus, and ν is Poisson's ratio.A first term in the formula (the term shown by “sample”) is a term towhich the elastic modulus of the sample contributes, and a second term(term shown by “indenter”) is a term to which the elastic modulus of theindenter contributes.

As shown in the formula (1), the complex elastic modulus is obtainedfrom the sum of the first term to which the elastic modulus of thesample contributes and the second term to which the elastic modulus ofthe indenter contributes. However, since the elastic modulus of theindenter is much higher than that of the sample, the second term can beignored, so that the complex elastic modulus approximately shows theelastic modulus of the sample.

Moreover, the indentation hardness is hardness measured by anindentation method and obtained by dividing the maximum press fit weightof the indenter by a projection area at the maximum press fit. Here, theprojection area at the press fit is obtained by a geometric shape of theindenter and a contact depth when the indenter presses the sample. Bymultiplying this indentation hardness by 76, it can be treated equallyto Vickers hardness, which is generally used as an indicator ofhardness.

$\begin{matrix}{{{Formula}\mspace{14mu}(1)}\mspace{625mu}} & \; \\{\frac{1}{Er} = {\left( \frac{1 - v^{2}}{E} \right)_{sample} + \left( \frac{1 - v^{2}}{E} \right)_{indenter}}} & (1)\end{matrix}$

Table 1 shows a measurement result of complex elastic modulus andindentation hardness of the layer including polycrystalline silicon andthe layer including amorphous silicon. The result shows an average valueof three measurement results.

According to the result shown in Table 1, the layer includingpolycrystalline silicon has higher elastic modulus than the layerincluding amorphous silicon. In other words, Table 1 indicates that, inthe case where structure bending force acts, the layer includingpolycrystalline silicon has stronger resistance against bending than thelayer including amorphous silicon.

Moreover, the result shown in Table 1 indicates that the layer includingpolycrystalline silicon is harder than the layer including amorphoussilicon.

TABLE 1 complex elastic indentation Sample modulus (GP a) hardness (GPa) the layer including amorphous silicon 141 15.5 the layer includingpolycrystalline silicon 153 20.3

By thus stacking semiconductor layers having different elastic modulusand hardnesses, it is possible to manufacture the structure body 400having both of hardness and high flexibility against bending. Forexample, even though breaking occurs due to crystal defects of the layerincluding polycrystalline silicon, the breaking is unlikely to spread tothe layer including amorphous silicon when the layer are stacked;therefore, the breaking can be stopped before the layer includingamorphous silicon. Thus, the balance between flexibility and hardnesscan be determined by a ratio between thicknesses of stacked layers.

<Stack Example 1 of Structure Layer>

In a case of crystallizing silicon with the use of metal as a catalystas described in Embodiment Mode 1, metal can be selectively added to thelayer including amorphous silicon. For example, a structure layer can beformed with a layer including polycrystalline silicon obtained bypartial crystallization of the layer including amorphous silicon.Further, in a case of crystallizing silicon with the use of a laser, astructure layer can be formed to have partially the layer includingpolycrystalline silicon obtained by selective irradiation of the layerincluding amorphous silicon with a laser beam.

When such a method is employed, a structure layer over the spatialportion of the structure body 400 can be partially crystallized, therebyforming a structure layer with a layer 404 including amorphous siliconand a layer 403 including polycrystalline silicon. Such a structurelayer can be formed as follows. A sacrifice layer is formed over asubstrate, and the layer 404 including amorphous silicon is formedthereover. Then, a metal catalyst is added to only a part of the layer404 including amorphous silicon over the sacrifice layer, or the part ofthe layer 404 is irradiated with a laser beam.

By changing the concentration of metal to be added, heating conditions,conditions of a laser used for irradiation, or the like, a structurelayer can be formed in which only a brace portion 406 of a beamstructure is formed of a layer including amorphous silicon, and a beamportion 405 and a portion of the structure layer in contact with thesubstrate are crystallized so as to be formed of a layer includingpolycrystalline silicon, as shown in FIG. 21C. When the structure layeris formed as described above, the beam portion 405 which is movable canhave high tenacity and the brace portion 406 can have flexibility.

Further, it is generally known that a silicon alloy in which metal iscombined with silicon has high strength. Therefore, the metal which isused as a catalyst when crystallizing the layer including amorphoussilicon does not necessarily need to be removed from the semiconductorlayer. The metal can be added to the semiconductor layer entirely orpartially. The metal added can remain in the whole semiconductor layeror can be selectively removed so as to remain partially. If necessary, aconductive silicon alloy layer which is still harder can be formedthrough appropriate heat treatment.

A conductive structure layer having flexibility and hardness can beformed by arbitrarily stacking any of such a layer including a siliconalloy, the above-described layer including polycrystalline silicon(polysilicon layer), and an amorphous silicon layer.

The layer including polycrystalline silicon which is crystallized byaddition of a metal catalyst and laser irradiation includespolycrystalline silicon in which crystals are grown perpendicularly tothe substrate. On the other hand, it includes polycrystalline silicon inwhich crystals are grown parallel to the substrate when irradiated witha laser beam without using metal. It is thought that such layersincluding polycrystalline silicon with different crystallizationdirections are different in hardness and elastic modulus. Thus, asemiconductor layer excellent as a structure layer can be formed bystacking both of them.

For example, a structure layer in which layers having different crystaldirections are stacked can be formed by stacking a layer includingpolycrystalline silicon crystallized with the use of metal and a layerincluding polycrystalline silicon crystallized without the use of metal.Therefore, even when a minute crack is caused in a layer included in thestructure layer, the crack is stopped at another layer with a differentcrystal direction, the structure layer can be prevented from beingdestroyed wholly, and a structure layer with high strength can beformed.

The structure body 400 including a structure layer formed by stacking aplurality of layers can be formed as shown in FIG. 21D by arbitrarilystacking the layers including polycrystalline silicon with differentcrystallization directions, the above-described layer includingamorphous silicon, and the layer including a silicon alloy. Here, FIG.21D shows the structure body 400 including a structure layer which isformed by stacking three layers 407, 408, and 409 selected from thelayers including polycrystalline silicon with different crystallizationdirections, the layer including amorphous silicon, and the layerincluding a silicon alloy.

Thus, the structure body 400 having necessary properties (such ashardness, flexibility, and conductivity) can be manufactured when itsstructure layer is formed by stacking layers having various properties.

In addition, the structure layer can be formed by stacking a pluralityof layers which is formed through repetitive formation and processing,as shown in FIG. 21E. For example, in a case of forming the structurelayer using only the layer including amorphous silicon, the structurelayer can be formed by formation and processing of a first layer 410including amorphous silicon and then similar formation and processing ofa second layer 411 including amorphous silicon. Here, the layers to bestacked can be processed by etching after formation of a resist mask bya photolithography method.

When the structure layer is formed by stacking layers through repetitiveformation and processing, the structure layer can have less internalstress. For example, even in a case of using a layer which has highinternal stress and which is difficult to be formed to be thick at atime like amorphous silicon, the layer with a necessary thickness as thestructure layer can be obtained by employing this method. In a case ofusing a layer including amorphous silicon, the structure layer can beformed by repeatedly performing a plurality of times of film formationand dehydrogenation through heating.

Even in a case of forming the structure layer by stacking differentlayers, for example, in a case of forming the structure layer bystacking a layer including amorphous silicon and a layer includingpolycrystalline silicon, the structure layer can be formed by repetitiveformation and processing of each layer. In a case of forming thestructure layer by stacking different layers as described above, thestructure layer can also be formed by successively forming layers andthen processing them, as shown in FIG. 21A. However, when the structurelayer is formed through repetitive film formation and processing, thestacked layers can be prevented from being separated at an interface dueto internal stress of the stacked layers. Such a method is particularlyeffective when the structure layer is formed using a layer having highinternal stress.

A combination of layers to be stacked for forming the structure layercan be freely selected from the following layers: the above-describedlayers including polycrystalline silicon with different crystallizationdirections, the layer including amorphous silicon, and the layerincluding a silicon alloy. Accordingly, a structure layer havingarbitrary characteristics such as flexibility, hardness, andconductivity can be formed.

As in the above-described example, it is possible to form a structurebody including a structure layer with desired properties by stacking orpartly forming silicon layers or layers of silicon compounds havingvarious properties in various ways.

<Stack Example 2 of Structure Layer>

In order to enhance strength of the structure layer, a structure body inwhich a brace portion of a beam structure is reinforced can be formed asshown in FIGS. 22A to 22D. In specific, a sacrifice layer 412 is formed,and a first layer 413 is formed thereover using a material whichreinforces a brace portion as shown in FIG. 22A. After that, anisotropicdry etching is applied, so that the first layer 413 can remain only onsides of the sacrifice layer 412 as shown in FIG. 22B. In thisembodiment mode, this remaining portion is referred to as a reinforcingportion 414.

Next, a structure layer 415 is formed over the sacrifice layer 412 andthe reinforcing portion 414 as shown in FIG. 22C. The structure layer415 can be formed using various materials and methods as described inEmbodiment Modes 1 to 3 and this embodiment mode. After that, sacrificelayer etching is performed. Accordingly, a structure body which includesa spatial portion 416 and the reinforcing portion 415 below thestructure layer 415 can be formed as shown in FIG. 22D.

When the structure layer is formed over a thick layer such as asacrifice layer, the thickness of the structure layer in a step portion,that is, a brace portion of a beam structure is thin, so that thestrength of the structure body is lowered. The strength of the structurelayer can be increased by formation of the reinforcing portion 414 inthe structure body as in the examples described with reference to FIGS.22A to 22D.

Note that this embodiment mode can be freely combined with any ofEmbodiment Modes 1 to 3.

(Embodiment Mode 5)

This embodiment mode describes an example of a structure and a functionof the micromachine of the present invention. The micromachine of thepresent invention is characterized by including a structure body with athree-dimensional structure, and an electric circuit having asemiconductor element and controlling the structure body.

FIG. 23 shows a conceptual diagram of a micromachine. A micromachine 501includes a structure body 502 and an electric circuit 503 which includessemiconductor elements.

The structure body 502 included in the micromachine 501 has a spacewhich is formed by removing a sacrifice layer formed between a substrateand a structure layer, and the structure layer is movable in the spacein many cases. The structure body 502 can function as a sensor fordetecting a physical quantity or an actuator for converting a signalfrom the electric circuit 503 into displacement. In addition, as shownin FIG. 23, the micromachine 501 can include a plurality of structurebodies (a first structure body 506, a second structure body 507, and thelike in the diagram).

The electric circuit 503 included in the micromachine 501 includes aninterface circuit 504 for performing communication with an externalcontrol device, and a control circuit 505 which processes a signal forcontrolling the structure body. In addition, the electric circuit 503can include an amplifier circuit which amplifies an output signal fromthe structure body, an A/D converter which converts a control signalfrom the external control device from an analog signal to a digitalsignal, a D/A converter which converts from a digital signal to ananalog signal, a memory which stores a control program of the structurebody, a memory control circuit which controls the memory, and the like.

Next, the function of the micromachine having the above structure isdescribed with reference to FIGS. 24A to 24C. For example, themicromachine 501 of the present invention includes the structure body502 and the electric circuit 503 as shown in FIG. 24A. In addition, themicromachine 501 is connected to an external control device 508 forcontrolling the micromachine 501 with a cable (transmission line) 509,and a control signal and a driving power are supplied from the externalcontrol device 508 to the micromachine 501. Here, a transmission linefor transmitting and receiving a control signal and a transmission linefor supplying power may be the same or different.

For example, in a case where the structure body 502 functions to detecta physical quantity, substance concentration, or the like, themicromachine 501 can function as a sensor in which information detectedby the structure body 502 is processed by the electric circuit 503 andis transmitted to the external control device 508. In this case, theelectric circuit 503 can include the control circuit, the A/D converter,the D/A converter, the memory, the memory control circuit, and the likeas described above.

As shown in FIG. 24B, the micromachine 501 of the present invention caninclude the electric circuit 503 which includes a wireless communicationcircuit 510 communicating with the external control device without wire,and other circuits, and the structure body 502. Here, the wirelesscommunication circuit 510 can include an antenna 511 for transmittingand receiving an electromagnetic wave, a power supply circuit whichgenerates driving power of the electric circuit 503 and the structurebody 502 from the electromagnetic wave received by the antenna 511, ademodulation circuit which demodulates a signal from the electromagneticwave received by the antenna 511, and the like. The wirelesscommunication circuit 510 can further include, as a power source, abattery, a power generating circuit which generates power from light,heat, or the like, and the like besides the power supply circuit whichgenerates driving power from an electromagnetic wave.

Thus, when the micromachine includes the wireless communication circuit510 and communicates with the external control device 508 using anelectromagnetic wave without a wire, the micromachine 501 is not limitedby a transmission cable, and the degree of freedom of operable range canbe enlarged. With the capability of wireless communication as describedabove, it becomes possible to realize a micromachine which can belocated anywhere and is familiar to a user. In this case, the externalcontrol device 508 which controls the micromachine 501 also includes awireless communication circuit, an antenna 512, and the like forcommunication with the micromachine 501.

As shown in FIG. 24C, the micromachine 501 can constitute a part of asemiconductor device (such as an RFID tag or an IC tag) which performswireless communication. In other words, it is possible to manufacture asemiconductor device (=micromachine) in which a passive element such asa capacitor or an inductor, a switch, a waveguide for transmitting ahigh-frequency signal, or the like included in the wirelesscommunication circuit 510 is formed using a structure body. In thiscase, the micromachine 501 includes the wireless communication circuit510, a demodulation circuit 513, a signal processing circuit 514, andthe like, and the wireless communication circuit 510, the demodulationcircuit 513, and the like each include a passive element, a switch, orthe like which is formed using a structure body.

When the passive element is formed using a structure body, bettercharacteristics than ever before can be obtained. Accordingly,highly-sensitive wireless communication can be performed when a wirelesscommunication circuit is formed using the passive element. Further, asemiconductor device capable of communication in a high-frequency bandand a broad-frequency band can be provided.

The micromachine of the present invention can also include a memory inwhich a storage element is formed using a structure body. Further, themicromachine of the present invention can include the above-describedwireless communication circuit and memory.

Next, FIGS. 25A and 25B show examples of the structure body included inthe micromachine of the present invention. A structure body shown inFIG. 25A includes a first conductive layer 520 and a structure layer 521over a substrate, and a spatial portion 522 between the first conductivelayer 520 and the structure layer 521. This spatial portion 522 isformed by forming a sacrifice layer and the structure layer 521 over thefirst conductive layer 520 and then removing only the sacrifice layer byetching.

Further, the sacrifice layer has a very important role in forming thestructure body, which serves to form the spatial portion 522 between thestructure layer 521 and the substrate by being removed by sacrificelayer etching. However, the structure body of the micromachine in theform of an end product often does not include the sacrifice layerbecause the sacrifice layer is removed by sacrifice layer etching. Forsacrifice layer etching, the sacrifice layer is preferably formed usinga substance which can have high selectivity to the first conductivelayer 520 and the structure layer 521 and can be easily removed byetching.

The spatial portion 522 formed by etching the sacrifice layer is formedbetween the substrate and the structure layer 521, that is, in a portionwhere the sacrifice layer has been located.

The structure layer 521 is often formed with a stacked structure of aninsulating layer 524 and the second conductive layer 523 which faces thefirst conductive layer 520 with the spatial portion 522 interposedtherebetween. However, the structure layer is not limited to the aboveexample, and can also be formed with a single layer of a conductivelayer or an insulating layer.

The structure body formed as described above includes the firstconductive layer 520 formed over the substrate, and the secondconductive layer 523 which faces the first conductive layer 520 with thespatial portion 522 interposed therebetween. One of these two conductivelayers is a “fixed electrode” which is fixed to the substrate and is notmovable, and the other is a “movable electrode” which is movable in thespatial portion. Here, the terms “fixed electrode” and “movableelectrode” are used to express whether the electrode is mechanicallymovable or fixed to the substrate or the like, and does not mean that apotential applied to the electrode is fixed or movable.

As described above, the structure body can function as an actuator inwhich the movable electrode (or the structure layer) is moved by voltageapplication between the fixed electrode and the movable electrode andattraction of the movable electrode to the fixed electrode side byelectrostatic attraction. Since the capacitance between two electrodeschanges when the structure layer 521 is moved in the spatial portion 522due to external force (such as pressure and acceleration), the structurebody can function as a sensor which detects the capacitance change.

Alternatively, the structure body can have a pectinate shape and canmove along a direction parallel to the substrate as shown in FIG. 25B.In this case, the structure body includes a fixed electrode 525 (firstconductive layer) provided on a side of a pectinate shape fixed to thesubstrate (that is, a side perpendicular to the substrate), and astructure layer 526 which is formed so as to engage with the fixedelectrode having a pectinate shape with a space interposed therebetween.The structure layer includes a movable electrode 527 (second conductivelayer) on a side opposite to the fixed electrode (that is, also a sideperpendicular to the substrate).

The structure body as described above is fixed to the substrate byconnection of a part thereof to a layer formed over the substrate, andis movable along a predetermined direction (for example, a direction ofthe pectinate shape). For example, in a case of the structure body shownin FIG. 25B, the structure body is separated from the substrate with aspace between the fixed electrode 525 and the movable electrode 527 andbetween the substrate and the structure layer 526. Further, thestructure body has a structure in which the structure layer 526 is fixedto a part of the substrate at two points (528 in the drawing) of aportion without the pectinate shape and is movable along a direction ofthe pectinate shape (from right/left to left/right in the drawing).

As described above with reference to FIGS. 25A and 25B, structure bodieswith various shapes can be formed. The structure body shown in FIG. 25Aincludes the fixed electrode (first conductive layer 520) and themovable electrode (second conductive layer 523) on a plane parallel tothe substrate, and a space between these two electrodes. On the otherhand, the structure body shown in FIG. 25B includes the fixed electrode525 and the movable electrode 527 which are perpendicular to thesubstrate, and a space between these two electrodes and between thesubstrate and the structure layer. Structure bodies having differentshapes, in which movable directions of structure layers are different,can be used for different purposes (for example, sensors for differentdirections and different physical quantities).

Besides the above-described examples, a structure body including a spaceformed by removal of a sacrifice layer and a structure layer which ishowever not movable can be formed. For example, a passive element suchas an inductor or a capacitor, a waveguide, a switch, or the like, apart of which is supported by a substrate and another part of which isseparated from the substrate, can be formed. When a passive element or awaveguide is formed to be separated from a substrate, influence from thesubstrate can be reduced. When a high-frequency circuit is formed usingthis, the circuit can be formed to have little loss and good frequencycharacteristics.

The above-described structure bodies are mere examples, and a structurebody can be formed to have a shape suited to a purpose through stepsaccording to the purpose and a predetermined function by various drivingmethods. For example, the structure body shown in FIG. 25A can be usedas a sensor which detects displacement of the structure layer due toexternal force, and can alternatively be used as a variable capacitorwhich changes a capacitance between two electrodes. Thus, one structurebody can have different functions by using different driving methods.

As described above, the structure body included in the micromachine ofthe present invention can constitute not only a part of a sensor or anactuator but also a part of an electric circuit, such as a passiveelement or a waveguide. A passive element (such as a capacitor, aninductor, or a resistor) is an important component, for example, in acase of performing wireless communication using a high-frequency range,but it was difficult to form a passive element which operates at highspeed with little loss through steps of forming a general semiconductorelement (such as a CMOS or a BiCMOS). However, when a passive element isformed using the structure body formed through the above-describedsteps, the passive element can have favorable characteristics.

Conventionally, in the case of treating a minute object having a size ofsubmillimeter, such a process has been necessary that a structure of theminute object is magnified first, a person or a computer obtainsinformation thereof and carries out information processing and operationsetting, and the operation is reduced in size and sending to the minuteobject. In contrast, the micromachine described in this embodiment modecan treat a minute object by only transmission of a dominant conceptinstruction from a person or a computer. In other words, once a personor a computer determines a purpose and sends an instruction, themicromachine can operate by obtaining and processing information on anobject using a sensor or the like.

Note that this embodiment mode can be freely combined with any ofEmbodiment Modes 1 to 4.

This application is based on Japanese Patent Application serial no.2006-076728 filed in Japan Patent Office on Mar. 20, 2006, the entirecontents of which are hereby incorporated by reference.

What is claimed is:
 1. A micromachine comprising: a substrate; astructure body over the substrate, the structure body comprising: afirst conductive layer; a first insulating layer; a spatial portion overthe first conductive layer and the first insulating layer; a secondinsulating layer over the spatial portion; and a second conductive layerover the spatial portion; and an opposite substrate facing the substratewith the structure body interposed therebetween.
 2. A micromachinecomprising: a substrate; a structure body over the substrate, thestructure body comprising: a first conductive layer; a first insulatinglayer over the first conductive layer; a spatial portion over the firstinsulating layer; a second insulating layer over the spatial portion;and a second conductive layer over the second insulating layer; and anopposite substrate facing the substrate with the structure bodyinterposed therebetween.
 3. A micromachine comprising: a substrate; astructure body over the substrate, the structure body comprising: afirst conductive layer; a first insulating layer over the firstconductive layer; a spatial portion over the first insulating layer; asecond insulating layer over the spatial portion; and a secondconductive layer over the second insulating layer; and an oppositesubstrate facing the substrate with the structure body interposedtherebetween, wherein the second conductive layer overlaps with twoopposite side surfaces of the spatial portion.
 4. The micromachineaccording to claim 1, wherein the second conductive layer is a movableelectrode, and wherein a height of the spatial portion is variable dueto application of voltage between the first conductive layer and thesecond conductive layer.
 5. The micromachine according to claim 2,wherein the second conductive layer is a movable electrode, and whereina height of the spatial portion is variable due to application ofvoltage between the first conductive layer and the second conductivelayer.
 6. The micromachine according to claim 3, wherein the secondconductive layer is a movable electrode, and wherein a height of thespatial portion is variable due to application of voltage between thefirst conductive layer and the second conductive layer.
 7. Themicromachine according to claim 1, wherein a portion of the secondconductive layer has a same elevation as a portion of the spatialportion with respect to the substrate.
 8. The micromachine according toclaim 2, wherein a portion of the second conductive layer has a sameelevation as a portion of the spatial portion with respect to thesubstrate.
 9. The micromachine according to claim 3, wherein a portionof the second conductive layer has a same elevation as a portion of thespatial portion with respect to the substrate.
 10. The micromachineaccording to claim 1, wherein the spatial portion comprises a sidesurface inclined with respect to a top surface of the substrate, andwherein a portion of the second conductive layer is inclined in responseto the inclination of the side surface of the spatial portion.
 11. Themicromachine according to claim 2, wherein the spatial portion comprisesa side surface inclined with respect to a top surface of the substrate,and wherein a portion of the second conductive layer is inclined inresponse to the inclination of the side surface of the spatial portion.12. The micromachine according to claim 3, wherein the two opposite sidesurfaces of the spatial portion are inclined with respect to a topsurface of the substrate, and wherein two portions of the secondconductive layer are inclined in response to the inclinations of the twoopposite side surfaces of the spatial portion.
 13. The micromachineaccording to claim 1, wherein a top surface, a bottom surface, and sidesurfaces of the spatial portion are electrically insulating.
 14. Themicromachine according to claim 2, wherein a top surface, a bottomsurface, and side surfaces of the spatial portion are electricallyinsulating.
 15. The micromachine according to claim 3, wherein a topsurface, a bottom surface, and the two opposite side surfaces of thespatial portion are electrically insulating.
 16. The micromachineaccording to claim 2, wherein the first insulating layer forms a bottomsurface of the spatial portion.
 17. The micromachine according to claim3, wherein the first insulating layer forms a bottom surface of thespatial portion.
 18. The micromachine according to claim 2, wherein thesecond insulating layer forms a top surface of the spatial portion. 19.The micromachine according to claim 3, wherein the second insulatinglayer forms a top surface of the spatial portion.
 20. The micromachineaccording to claim 1, further comprising an electronic circuit on thesubstrate, wherein the structure body is electrically connected to theelectronic circuit.
 21. The micromachine according to claim 2, furthercomprising an electronic circuit on the substrate, wherein the structurebody is electrically connected to the electronic circuit.
 22. Themicromachine according to claim 3, further comprising an electroniccircuit on the substrate, wherein the structure body is electricallyconnected to the electronic circuit.
 23. The micromachine according toclaim 1, further comprising an electronic circuit on the substrate,wherein the structure body is electrically connected to the electroniccircuit, and wherein an element of the structure body is formed from asame film as an element of the electronic circuit.
 24. The micromachineaccording to claim 1, further comprising an electronic circuit on thesubstrate, wherein the structure body is electrically connected to theelectronic circuit, and wherein an element of the structure body isformed from a same film as an element of the electronic circuit.
 25. Themicromachine according to claim 1, further comprising an electroniccircuit on the substrate, wherein the structure body is electricallyconnected to the electronic circuit, and wherein an element of thestructure body is formed from a same film as an element of theelectronic circuit.